A semiconductor device comprising: a semiconductor element having a pair of electrodes; a housing having a recess for accommodating the semiconductor element; a first lead electrode and a second lead electrode exposed on the bottom surface of said recess; an adhesive layer for die bonding between the semiconductor element and the first lead electrode; and electrically conductive wires for wire bonding between one electrode of the pair of electrodes of the semiconductor element and the first lead electrode and between the other electrode and the second lead electrode, wherein the housing has at least one wall formed to extend across the bottom surface of the recess so as to divide the surface of the first lead electrode into a die bonding area and a wire bonding area; the first lead electrode has a notch which is formed by cutting off a portion of an edge of the first lead electrode and located at least just below the wall; and the wall and the bottom portion of said housing are connected to each other through the notch. view more

A semiconductor device comprising: a semiconductor element having a pair of electrodes; a housing having a recess for accommodating the semiconductor element; a first lead electrode and a second lead electrode exposed on the bottom surface of the recess; an adhesive layer for die bonding between the semiconductor element and the first lead electrode; and electrically conductive wires for wire bonding between one electrode of the pair of electrodes of the semiconductor element and the first lead electrode and between the other electrode and the second lead electrode, wherein the housing has at least one wall formed to extend across the bottom surface of the recess so as to divide the surface of the first lead electrode into a die bonding area and a wire bonding area; the first lead electrode has a through hole located at least just below the wall; and the wall and the bottom portion of the housing are connected to each other through the through hole. view more

The molded package according to claim 1, wherein at least one of said positive lead electrode and said negative lead electrode is divided by said wall portion.

The molded package according to claim 2, wherein said wall portion is integral with said molded member.

The light emitting device according to claim 7, further comprising a protective element mounted on at least one of said positive lead electrode and said negative lead electrode so as to protect said light emitting element from overvoltage.

The light emitting device according to claim 7, wherein at least one of said positive lead electrode and said negative lead electrode is divided by said wall portion.

The light emitting device according to claim 10, wherein said wall portion is integral with said molded member.

A method of manufacturing a light emitting device, the method comprising: providing a lead frame comprising at least one notch; plating the lead frame; after plating the lead frame, providing an upper mold on a first surface of the plated lead frame and a lower mold on a second surface of the plated lead frame, and transfer-molding a thermosetting resin containing a light reflecting material in a space between the upper mold and the lower mold to form a resin-molded body; and cutting the resin-molded body and the plated lead frame along the at least one notch to form a resin package, the resin package comprising a resin part and at least one lead, and the cutting step being performed such that an outer surface of the resin part and an outer surface of the at least one lead are planar at an outer side surface of the resin package, wherein the plated lead frame is cut so as to form an unplated outer side surface on the lead. view more

The method according to claim 1, further comprising: providing a light emitting element in a concave portion of the resin package, wherein the transfer-molding step forms a plurality of concave portions corresponding to the convex portions of the upper mold, each of the concave portions comprising an inner bottom surface at which a portion of the lead frame is exposed. view more

A light emitting device comprising: a resin package comprising a resin part and at least one lead, wherein an outer surface of the resin part and an outer surface of the at least one lead are planar at an outer surface of the resin package, wherein a plating is disposed on an upper surface and a lower surface of the at least one lead, wherein an outer side surface of the at least one lead is unplated, and wherein a portion of the resin part is disposed over a portion of the plating on the upper surface of the at least one lead. view more

The light emitting device according to claim 17, wherein the at least one lead comprises a step on a bottom surface or outer surface thereof.

The light emitting device according to claim 17, wherein the at least one lead comprises two or more different levels.