An integrated circuit probe card inspection system for determining the location and length of a scrub mark which would be made by a probe tip on an integrated circuit bonding pad, comprising: a viewing system for providing a digital image of the probe tip, a window with a flat surface contacted by said probe tip, said viewing system obtaining said digital image through said window in a first state where said probe tip is driven in contact with said window with a first force, and in a second state where said probe tip is driven in contact with said window with a second force, said second force being different from said first force, a computerized means with software means to analyze the position of the probe tip within the digital image in said first and second states, and for determining the location and length of the scrub mark based on said positions. view more

An integrated circuit probe card inspection system according to claim 1, wherein the first force represents a substantially zero overdrive condition and the second force represents a non-zero overdrive condition.