The device of claim 83, wherein the electrical device comprises a micro via interconnect.

The device of claim 83, wherein the conductive layer fills the cavities sufficiently to produce a peel strength greater than a peel strength that would be produced by a single desmear process, and some of the teeth mechanically grip the dielectric material, more than by adherence. view more

An electrical device including: a dielectric material comprising a surface with cavities remaining after removal of some of the dielectric material; a conductive layer built up on the dielectric material so as to fill the cavities and form substantially angular teeth set in the dielectric material; and wherein the conductive layer is a portion of circuitry of an electrical device, and a plurality of the teeth being are at least 1 tenth of a mil deep and less than 1.75 tenths of a mil deep, and wherein at least one of the cavities includes an upgrade slope with respect to the surface of the dielectric material, and one of the teeth engages a portion of the dielectric material at the slope. view more

The device of claim 89, wherein the the conductive layer fills the cavities sufficiently so as to produce a peel strength greater than a peel strength that would be produced by a single desmear process, and some of the teeth mechanically grip the dielectric material, more than by adherence. view more

An electrical device including: a conductive layer of material built up on a surface of a layer of a dielectric material, the layers joined in a saw-tooth manner made of both materials in an interlocking bite; wherein the conductive layer is a portion of circuitry of an electrical device, the conductive layer is comprised of teeth such that a sample of the circuitry has a frequency of the teeth sufficient to provide at least 5,000 of the teeth per linear inch, the teeth the teeth set respectively in cavities of the bite and a plurality of the teeth are within the range of 1 tenth of a mil deep to 1.75 tenths of a mil deep, and wherein at least one of the cavities includes an upgrade slope with respect to the surface, and one of the teeth engages a portion of the dielectric material at the slope. view more

The device of claim 94, wherein the electrical device comprises a micro via interconnect.

An electrical device including: a conductive layer built up so as to fill undercuttings with respect to a surface of a dielectric material so as to form teeth in cavities, a plurality of the undercuttings being obtuse to the surface, wherein the conductive layer is a portion of circuitry of an electrical device, and a plurality of the teeth are within the range of 1 tenth of a mil deep to 1.75 tenths of a mil deep, and wherein at least one of the cavities includes an upgrade slope with respect to the surface of the dielectric material, and one of the teeth engages a portion of the dielectric material at the slope. view more

An electrical device including: a dielectric material comprising a surface; a conductive layer forming a portion of circuitry of an electrical device; and means for joining the conductive layer to the dielectric material, the means including a structuring of teeth built up on the dielectric material and comprised of the conductive layer and angled sufficiently for mechanically gripping the dielectric material in three dimensions, wherein a plurality of the teeth are within the range of 1 tenth of a mil deep to 1.75 tenths of a mil deep, and wherein at least one of the cavities includes an upgrade slope with respect to the surface of the dielectric material, and one of the teeth engages a portion of the dielectric material at the slope. view more

An electrical device including: a dielectric material having a surface remaining from removal of a portion of the dielectric material; and means for mechanically gripping a conductive layer to the surface of the dielectric material so that the conductive layer is burrowed in and under the top surface of the dielectric material, wherein the conductive layer forms a portion of circuitry of an electrical device, wherein the means for mechanically gripping is comprised of teeth, and a plurality of the teeth are within the range of 1 tenth of a mil deep to 1.75 tenths of a mil deep, and wherein at least one of the cavities includes an upgrade slope with respect to the surface of the dielectric material, and one of the teeth engages a portion of the dielectric material at the slope. view more

The device of any one of claims 83, 89, 93, 100, 101, 105, 109, 110, 111, 114, 115, 116, 120, or 121 wherein: a sample of the circuitry has a frequency of the teeth sufficient to provide at least 5,000 said teeth per linear inch.

An article of manufacture, the article comprising: an epoxy dielectric material delivered with solid content sufficient that etching the epoxy forms a non-uniformly roughened surface comprising cavities located in and underneath a surface of the dielectric material, and sufficient that the etching of the epoxy uses non-homogeneity with the solid content to bring about formation of the non-uniformly roughened surface with at least some of the cavities having a first cross-sectional distance proximate the initial surface and a substantially greater cross-sectional distance distant from the initial surface, and a conductive material, whereby the etching of the epoxy forms the cavities, and a portion of the conductive material in the cavities thereby forming teeth in the cavities, wherein the etching of the non-homogeneous composition forms the cavities, and wherein the conductive material forms a portion of circuitry of an electrical device. view more

The article of claim 14, wherein the etching includes a first etching and a second etching.

A process of making an article of manufacture, the process comprising: implementing a circuit design for an electrical device by coupling an epoxy dielectric material delivered with solid content sufficient that etching the epoxy forms a non-uniformly roughened surface comprising cavities located in, and underneath a surface of, the dielectric material, and sufficient that the etching of the epoxy uses non-homogeneity with the solid content in bringing about formation of the non-uniformly roughened surface with at least some of the cavities having a first cross-sectional distance proximate the surface and a substantially greater cross-sectional distance distant from the surface, with a conductive material, whereby the etching of the epoxy forms the cavities, and a portion of the conductive material in the cavities thereby forming teeth in the cavities, wherein the etching of the non-homogeneous composition forms the cavities, in circuitry of the electrical device. view more

The process of claim 13, wherein the etching includes a first etching and a second etching.

The process of claim 32, wherein the etching includes a first etching and a second etching.

An electrical device comprising: circuitry; conductive material being part of the circuitry and configured as angular teeth in filling cavities; and an epoxy dielectric material, disposed in combination with the circuitry and coupled with the conductive material in a configuration where the dielectric material comprises a non-uniformly roughened surface comprising cavities located in and underneath an initial surface of the dielectric material delivered with solid content being non-homogeneous and configured to bring about formation of the non-uniformly roughened surface by etching of the epoxy, at least some the cavities having a first cross-sectional distance proximate the initial surface and a substantially greater cross-sectional distance distant from the initial surface. view more

The electrical device of claim 80, wherein the cavities comprise cavities which substantially exhibit one or more of the following shapes: fanged and canine, and otherwise hooked teeth.

The electrical device of claim 80, wherein at least one of the teeth has a depth in a range of 1 tenth of a mil and less than about 2 tenths of a mil.

The electrical device of claim 80, wherein the circuitry comprises multilayer circuitry of the electrical device.

The electrical device of claim 82, wherein the etching includes a first etching and a second etching.

The electrical device of claim 86, wherein the etching includes a first etching and a second etching.

The electrical device of claim 88, wherein the etching includes a first etching and a second etching.

A product produced by the process of 13.

A product produced by the process of 21.

A process of making an article of manufacture, the process comprising: implementing a circuit design for an electrical device by coupling a dielectric material delivered with solid content, the dielectric material and the solid content being non-homogeneous materials, sufficient that etching the dielectric material forms a non-uniformly roughened surface comprising cavities located in, and underneath a surface of, the dielectric material, and sufficient that the etching of the dielectric material uses non-homogeneity with the solid content in bringing about formation of the non-uniformly roughened surface with at least some of the cavities having a first cross-sectional distance proximate the surface and a greater cross-sectional distance distant from the surface, with a conductive material, whereby the etching of the dielectric material forms the cavities, and a portion of the conductive material in the cavities thereby forming teeth in the cavities, wherein the etching of the non-homogeneous composition forms the cavities, in circuitry of the electrical device. view more

A process of making an article of manufacture, the process comprising: implementing a circuit design for an electrical device by coupling a dielectric material delivered with sufficient solid content, the dielectric material and the solid content being non-homogeneous materials, that etching of the dielectric material forms a non-uniformly roughened surface of cavities located in, and underneath an initial surface of, the dielectric material and sufficient that the etching of the dielectric material uses non-homogeneity with the solid content in bringing about formation of the non-uniformly roughened surface of the cavities, and the cavities have a cross-sectional distance proximate the initial surface and a greater cross-sectional distance distant from the initial surface, and a conductive material, a portion of the conductive material in the cavities thereby forming teeth in the cavities, wherein the etching of the dielectric material forms the cavities so that a plurality of the teeth each expand below a respective narrower region which is closer to the initial surface, in circuitry of the electrical device. view more

A product produced by the process of claim 2.

A product produced by the process of claim 3.

A product produced by the process of claim 4.

A product produced by the process of claim 10.

A product produced by the process of claim 11.

A product produced by the process of claim 12.