Anza Technology, Inc. has filed suit against Toshiba (2:17-cv-01688) in the Eastern District of California, alleging infringement of a single patent already at issue in the NPE’s litigation campaign. The patent is generally directed to certain bonding machines and techniques, with Toshiba accused of infringement through the provision of a wide range of products allegedly using flip chip bonding techniques during manufacturing. The new case joins another filed, against Mushkin, Inc. (perhaps erroneously), in the Eastern District of California, as well as three active cases in the Southern District of California and a suit against Xilinx filed in the District of Colorado.
Anza Technology, Inc. has added a case against Xilinx (1:17-cv-00687) to the litigation campaign that it began roughly one year ago. The new complaint asserts three patents (6,354,479; 6,935,548; 7,389,905) generally related to certain bonding machines and techniques. Anza targets Xilinx 7 Series FPGAs, which it contends are packaged using a flip chip bonding process. The named inventors on the patents asserted are Mary and Steven Reiber, principals at Anza, who started this campaign in their individual capacities nearly a decade ago.