Tessera [NPE] filed suit against Amkor Technology, alleging that Amkor’s vacuum encapsulated and molded underfill semiconductor packages are not licensed by Tessera as evidenced by a preliminary arbitration award made on July 5, 2012 by the International Court of Arbitration of the International Chamber of Commerce (ICC). Based on a preliminary review of the interim arbitration award, Tessera is seeking more than $125 million from Amkor.  This is the second time the two companies have gone to the ICC to resolve a royalty dispute.  The first arbitration lasted three years until Tessera was awarded $64M in 2009.  According to Amkor’s investor information, the company supplies semiconductor packaging to chip vendors including Altera, Analog Devices, Broadcom, Infineon, LSI, Qualcomm, ST Microelectronics, TI and Toshiba. Tessera  has filed six prior patent lawsuits in district courts since 2005 against defendants that include A-DATA Technology, AMD, Micron, Motorola and Sony.  Tessera has also been an active litigant at the ITC, filing four complaints since 2000. Since 2000, Tessera has faced six complaints for declaratory judgment from Advanced Semiconductor Engineering, Chipmos Technologies, Micron, Powertech Technology, Samsung and Siliconware Precision Industries.  The patent-in-suit was developed at Tessera and was issued in April 2000. 7/6, District of Delaware, no judge yet assigned, 1:2012cv00852.