Spansion and Hynix Announce Patent Cross License

  • April 4, 2012

April 4, 2012 – Spansion and SK Hynix announced an alliance to deliver Spansion SLC NAND products to the embedded market and that the companies have entered into a patent cross-licensing agreement.


Access to the full article is currently available to RPX members only. Please contact us if you need further information.



×
×

Thank you for your feedback

×
×