Semiconductor Packaging Technologies (SPT) [NPE] filed suit against Advanced Micro Devices (AMD), alleging that AMD’s semiconductors infringe a patent related to a semiconductor package including a package board, a semiconductor chip mounted on the package board, and a metal lid member provided on the package board so that the semiconductor chip is sealed with the metal lid member. This is the first patent infringement suit initiated by SPT, a subsidiary of Acacia Research.  The patent-in-suit originated with NEC and was assigned to Renesas Electronics in April 2010.  12/28, Western District of Texas, 1:2011cv01115.