Inventor-backed Power Density Solutions LLC has sued IBM (4:19-cv-03710) in the Northern District of California, adding a second case to the litigation campaign that it began against Parker-Hannifin in the Southern District of California in March 2018. Ending a few months later, in August 2018, that suit concerned a later-issuing family member of the patent now asserted against IBM, which is accused of infringement through the provision of computer chips and components featuring ICECool, IBM’s chip-embedded cooling technology. The patents generally relate to cooling electronic components by pumping cooling fluids through “passageways”.