Longhorn IP LLC’s Katana Silicon Technologies LLC has filed a second patent infringement lawsuit, accusing TSMC (6:19-cv-00695) of infringing five patents originating with Sharp, including the same two patents that it asserted in a May 2019 case against Samsung, together with two other patents sourced elsewhere. The patents all generally relate to semiconductor/transistor fabrication, with Katana identifying TSMC’s accused products as semiconductor devices made at a “variety of different process nodes”, including the Altera Stratix IV GX FPGA, Apple A9 chip, Qualcomm MDM9235M 4G LTE modem and advanced modem; semiconductor packages using the Integrated Fan-Out (InFO) wafer level packaging technology, including the Apple A10, Apple A11, and G7232 Rear-Cam ISPA; and Through-Silicon-Via (TSV) CMOS Image Sensors.