×

IC Maker Files Mobile Payment Suit

January 9, 2012

Maxim Integrated Products [NCE] filed three separate suits against Capital One, Expedia, and Starbucks over mobile applications. The four patents-in-suit generally relate to data exchange between modules. This suit appears to be the first suit initiated by a semiconductor company targeting  retailers and retail banks for contactless mobile payments.  1/6, Eastern District of Texas, 4:2012cv00005; 4:2012cv00006; 4:2012cv00007.


Access to the full article is currently available to RPX members only. Please contact us if you need further information.



Related News

×
×