Back in November 2019, Bell Semiconductor, LLC (Bell Semic) began litigating the patents that the Hilco Inc. (d/b/a Hilco Global) company acquired from Broadcom, asserting nearly 20 assets from that acquisition, in overlapping sets, against Renesas (IDT), TI, NXP Semiconductors, and Microchip Technology (in that order). This past February, the only remaining open case in that campaign, the one against NXP, was stayed pending resolution of related inter partes reviews (IPRs). Bell Semic has now fired off a new round of complaints—filed in multiple judicial districts separately against AMD, Analog Devices, Infineon Technologies, KIOXIA, Marvell, Micron Technology, NVIDIA, NXP (again), Qualcomm, and Socionext and filed in the International Trade Commission (ITC) together against each of those companies as well as Acer, Bose, Lenovo (Motorola Mobility), SMC Networks (d/b/a IgniteNet), and Suteng Innovation Technology (d/b/a RoboSense)—this time over a single patent generally related to “inserting dummy metal into a circuit design”. Targeted throughout is the respective provision of semiconductor devices manufactured using certain design tools provided by various third parties, including Cadence Design Systems, Siemens, and/or Synopsys.