This past week, Bell Semiconductor, LLC (Bell Semic) expanded both of its litigation campaigns. In a pair of Central District of California complaints, it sued Qualcomm, together with CommScope, HP Enterprise (HPE) (Aruba Networks), Linksys, NETGEAR, and TP-Link (8:22-cv-01519); and NVIDIA, together with Amazon, Best Buy, Dell, GIGA-BYTE, Micro-Star International (MSI), and Nintendo (2:22-cv-05747), with both complaints asserting packaging patents acquired from Broadcom. In its other campaign, which concerns a single patent from the same source and generally related to “inserting dummy metal into a circuit design”, Bell Semic upped the number of district court defendants to include ams-OSRAM (3:22-cv-11857), MACOM Technology Solutions (1:22-cv-11290), Maxlinear (3:22-cv-01178), OmniVision Technologies (8:22-cv-01512), Silicon Laboratories (1:22-cv-11292), and Skyworks Solutions (1:22-cv-11291). Each defendant is accused of infringement through the provision of various semiconductor devices that are manufactured using certain design tools provided by Cadence Design Systems, Siemens, and/or Synopsys. This burst of activity follows a late July initial determination to grant a motion to terminate an International Trade Commission (ITC) investigation that had been instituted based on an April 2022 complaint asserting the same “dummy metal” patent.