Bell Semiconductor, LLC (Bell Semic) has filed a third Eastern District of Texas lawsuit against Texas Instruments (TI) (4:23-cv-00609), this one asserting three packaging patents and targeting the provision of certain semiconductor devices, including the TI 66AK2E05XABD and TI 66AK2H05 systems-on-chip (SoCs). Bell Semic sued TI in February 2020 in this same campaign but over different patents; the case was dismissed with prejudice in March 2021 after Bell Semic filed a notice of settlement. This past February, Bell Semic sued TI in its other campaign, the one centered around the use of design tools provided by Cadence, Synopsys, and/or Siemens. There, TI has filed a motion to stay litigation in favor of the declaratory judgment action that Cadence and Synopsys filed against Bell Semic late last year.