Proceeding pro se, individual inventor Chien-Min Sung has sued Samsung (4:23-cv-00752) and TI (4:23-cv-00753) in the Eastern District of Texas. The patents-in-suit, one of which was previously asserted against the inventor’s joint venture partner, are described in the complaint as related to “chemical mechanical polishing/planarization (“CMP”) pad dressers and dressing and conditioning methods associated with pad conditioning (e.g., smoothing, polishing, and dressing)”. The defendants are accused of infringement through the use of certain CMP pad conditioners—including those provided by 3M, Abrasive Technology, EHWA, Seasol, and Shinhan—in the manufacture or fabrication of their various semiconductor products, as well as products incorporating them.