Xilinx Sued in Anza Technology’s Flip Chip Bonding Campaign

  • March 25, 2017

Anza Technology, Inc. has added a case against Xilinx (1:17-cv-00687) to the litigation campaign that it began roughly one year ago. The new complaint asserts three patents (6,354,479; 6,935,548; 7,389,905) generally related to certain bonding machines and techniques. Anza targets Xilinx 7 Series FPGAs, which it contends are packaged using a flip chip bonding process. The named inventors on the patents asserted are Mary and Steven Reiber, principals at Anza, who started this campaign in their individual capacities nearly a decade ago.


View full article with free 30-day trial
($79/month thereafter)


  • Over 7,000 news articles covering new patent cases, key policy decisions, and USPTO assignments
  • Advanced custom alerts for campaigns and entities
  • Proprietary litigation timelines
  • Full access to Federal Circuit, PTAB, and ITC dockets
  • Judge, venue, and law firm analytics



×
×

Thank you for your feedback

×
×