Last month, Advanced Integrated Circuit Process LLC (AICP) filed its first lawsuit, accusing TSMC of infringing seven patents that the plaintiff received from Winbond Electronics (Nuvoton Technology Corporation Japan) in late July 2024. Now, AICP has filed its second, asserting the same seven semiconductor fabrication patents against United Microelectronics (2:24-cv-00730), in another Eastern District of Texas complaint, this one targeting the provision of semiconductor devices manufactured at various process nodes (i.e., the 22 and 28 nanometer process nodes), as well as third-party components—including those manufactured by Microsemi and Qualcomm—that incorporate the accused semiconductor devices.