In its first case against TSMC, filed in August 2024, Advanced Integrated Circuit Process LLC (AICP) asserted seven of the more than 50 patents that it received from Winbond Electronics (Nuvoton Technology Corporation Japan). Last week, AICP hit TSMC again (2:25-cv-00324), targeting with four additional such assets the provision of semiconductor devices—including certain Apple, Broadcom, and Qualcomm chips—manufactured using various process nodes, including those that utilize FinFET technology. The second complaint drops three days after TSMC filed two petitions for inter partes review (IPR) of patents asserted in the first case.