STC.UNM, the technology transfer office of the University of New Mexico (UNM), has filed two new lawsuits. In the first, STC.UNM accuses TSMC (6:19-cv-00261) over a semiconductor fabrication patent issuing to the plaintiff in September 2015. TSMC is accused of infringement through the provision of semiconductor devices manufactured at “several different process nodes (i.e., minimum physical feature size or line width), including 7 nanometer, 10 nanometer, 12 nanometer, and 16 nanometer process nodes”. In the second, TP-Link (6:19-cv-00262) is accused of infringing three network data transmission patents issuing to Industrial Technology Research Institute (ITRI) through the provision of wireless networking products supporting the 802.11ac Wi-Fi standard, including Wi-Fi network adapters (the Archer T1U, Archer T4UH, Archer T4U, Archer T2UH, and Archer T2U) and mesh routers (Deco M9, and Deco M5).