In a new Eastern District of Texas complaint against SK hynix (2:24-cv-01078), Advanced Memory Technologies LLC has targeted the provision of “all NAND flash memory modules manufactured, sold, and/or offered for sale by SK Hynix”, including various solid-state drives (SSDs) such as “internal SSDs and portable SSDs; USB flash drives; PCI devices; flash package dies; and flash bare dies”; and “all DRAM modules manufactured, sold, and/or offered for sale by SK Hynix”. As earlier reported, the plaintiff received the asserted patents as part of a ten-patent assignment from Winbond Electronics (Nuvoton Technology Corporation Japan).

Last month, Advanced Integrated Circuit Process LLC (AICP) filed its first lawsuit, accusing TSMC of infringing seven patents that the plaintiff received from Winbond Electronics (Nuvoton Technology Corporation Japan) in late July 2024. Now, AICP has filed its second, asserting the same seven semiconductor fabrication patents against United Microelectronics (2:24-cv-00730), in another Eastern District of Texas complaint, this one targeting the provision of semiconductor devices manufactured at various process nodes (i.e., the 22 and 28 nanometer process nodes), as well as third-party components—including those manufactured by Microsemi and Qualcomm—that incorporate the accused semiconductor devices.

The USPTO recently made public the transfer of more than 50 US patents from Winbond Electronics (Nuvoton Technology Corporation Japan) to Advanced Integrated Circuit Process LLC (AICP), a Texas entity. The recipient has filed its first litigation, accusing TSMC (2:24-cv-00623) of infringing seven of the transferred assets in a new Eastern District of Texas complaint that targets the provision of semiconductor devices manufactured at various process nodes (i.e., the 5, 7, 10, 16, and 28 nanometer process nodes), as well as third-party electronic components (e.g., computer chips, computer graphics cards, and mobile devices)—including certain Apple, MediaTek, and NXP Semiconductors devices—that allegedly incorporate them.