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Inventor Asserts Chip Patents Against Apple, Huawei, and TSMC After Failed Partnership with General Patent Corporation
An individual inventor has filed suit against Apple, Huawei, and TSMC, alleging that the three companies have infringed four patents (6,518,668; 6,924,226; 7,199,052; 7,282,445) generally related to semiconductor fabrication (1:17-cv-00189). In a single complaint filed in the Eastern District of Texas, plaintiff Uri Cohen accuses TSMC of infringement for manufacturing certain mobile Systems-on-Chip (SoCs) for Apple and Huawei using its 16nm and 20nm processes, with Apple and Huawei alleged to infringe through the provision of smartphones incorporating those SoCs.
May 11, 2017