Semiconductor integrated circuit device
First Claim
1. A semiconductor integrated circuit device comprising:
- at least two I/O cell rows each including a plurality of I/O cells arranged in a first direction;
a plurality of external connection pads; and
a common power supply interconnect that connects together a plurality of first I/O cells configured either as I/O cells for supplying a power supply potential or as I/O cells for supplying a ground potential, the first I/O cells each included in a respective one of the at least two I/O cell rows, whereinthe first I/O cells connected together via the common power supply interconnect are arranged so as to overlap with each other in the first direction, andthe common power supply interconnect extends in a second direction perpendicular to the first direction, and is connected to a first pad which is one of the plurality of external connection pads and is located closest to the common power supply interconnect in the first direction among the plurality of external connection pads.
1 Assignment
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Accused Products
Abstract
Disclosed herein is a configuration for ensuring sufficient power supply ability and ESD protection capability for I/O cells in a semiconductor integrated circuit device, without increasing its circuit area. In two I/O cell rows, a pair of I/O cells for supplying a power supply potential or ground potential are connected together via a common power supply interconnect. The I/O cells are arranged so as to overlap with each other in a first direction in which the I/O cells are arranged. The common power supply interconnect extends in a second direction perpendicular to the first direction, and is connected to first pads that are located closest in the first direction to the common power supply interconnect.
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Citations
7 Claims
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1. A semiconductor integrated circuit device comprising:
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at least two I/O cell rows each including a plurality of I/O cells arranged in a first direction; a plurality of external connection pads; and a common power supply interconnect that connects together a plurality of first I/O cells configured either as I/O cells for supplying a power supply potential or as I/O cells for supplying a ground potential, the first I/O cells each included in a respective one of the at least two I/O cell rows, wherein the first I/O cells connected together via the common power supply interconnect are arranged so as to overlap with each other in the first direction, and the common power supply interconnect extends in a second direction perpendicular to the first direction, and is connected to a first pad which is one of the plurality of external connection pads and is located closest to the common power supply interconnect in the first direction among the plurality of external connection pads. - View Dependent Claims (2, 3, 4, 5)
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6. A semiconductor integrated circuit device comprising:
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first and second I/O cell rows each including a plurality of I/O cells arranged in a first direction; and an internal logic circuit arranged between the first and second I/O cell rows, wherein in the semiconductor integrated circuit device, the first I/O cell row is arranged inwardly from the internal logic circuit, and the second I/O cell row is arranged outwardly from the internal logic circuit, the I/O cells in the first and second I/O cell rows each include a high power supply voltage region and a low supply voltage region which are separated from each other in a second direction perpendicular to the first direction, and are arranged such that each low power supply voltage region is located closer to the internal logic circuit, the first I/O cell row includes at least one first I/O cell which is configured as an I/O cell for inputting and outputting a signal and which has a signal terminal in the low power supply voltage region of the first I/O cell, and the signal terminal of the first I/O cell is connected to the internal logic circuit via a signal interconnect. - View Dependent Claims (7)
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Specification