Bonded structures

• US 10,002,844 B1
• Filed: 12/21/2016
• Issued: 06/19/2018
• Est. Priority Date: 12/21/2016
• Status: Active Grant

• Current Assignee: Invensas Bonding Technologies, Inc. (Adeia Inc.)
• Original Assignee: Invensas Bonding Technologies, Inc. (Adeia Inc.)
• Inventors: Wang, Liang, Katkar, Rajesh, DeLaCruz, Javier A., Sitaram, Arkalgud R.
• Primary Examiner(s): Clark, Jasmine
• Application Number:
  US15/387,385
• Publication Number:
  US 20180174995A1
• Time in Patent Office: 545 Days
• CPC Class Codes: B81B 2207/012 the micromechanical device and the control or processing electronics being separate parts in the same package
• CPC Class Codes: B81C 1/00269 Bonding of solid lids or wafers to the substrate
• CPC Class Codes: B81C 1/00293 maintaining a controlled atmosphere with processes not provided for in B81C1/00285
• CPC Class Codes: B81C 2203/019 characterised by the material or arrangement of seals between parts
• CPC Class Codes: B81C 2203/035 Soldering
• CPC Class Codes: H01L 2224/05551 comprising apertures or cavities
• CPC Class Codes: H01L 2224/05552 in top view
• CPC Class Codes: H01L 2224/05555 being circular or elliptic
• CPC Class Codes: H01L 2224/05571 the external layer being disposed in a recess of the surface
• CPC Class Codes: H01L 2224/05647 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/05686 with a principal constituent of the material being a non metallic, non metalloid inorganic material
• CPC Class Codes: H01L 2224/06051 Bonding areas having different shapes
• CPC Class Codes: H01L 2224/06135 Covering only the peripheral area of the surface to be connected, i.e. peripheral arrangements
• CPC Class Codes: H01L 2224/06155 Covering only the peripheral area of the surface to be connected, i.e. peripheral arrangements
• CPC Class Codes: H01L 2224/06165 Covering only the peripheral area of the surface to be connected, i.e. peripheral arrangements
• CPC Class Codes: H01L 2224/06505 Bonding areas having different materials
• CPC Class Codes: H01L 2224/08121 the connected bonding areas being not aligned with respect to each other
• CPC Class Codes: H01L 2224/08237 the bonding area connecting to a bonding area disposed in a recess of the surface of the item
• CPC Class Codes: H01L 2224/29019 at the bonding interface of the layer connector, i.e. on the surface of the layer connector
• CPC Class Codes: H01L 2224/8001 Cleaning the bonding area, e.g. oxide removal step, desmearing
• CPC Class Codes: H01L 2224/80047 : by mechanical means, e.g. severing, pressing, stamping
• CPC Class Codes: H01L 2224/80357 : being flush with the surface
• CPC Class Codes: H01L 2224/80895 : between electrically conductive surfaces, e.g. copper-copper direct bonding, surface activated bonding
• CPC Class Codes: H01L 2224/80896 : between electrically insulating surfaces, e.g. oxide or nitride layers
• CPC Class Codes: H01L 2224/80948 : Thermal treatments, e.g. annealing, controlled cooling
• CPC Class Codes: H01L 23/10 : characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
• CPC Class Codes: H01L 23/49838 : Geometry or layout
• CPC Class Codes: H01L 23/528 : Geometry or layout of the interconnection structure H01L27/0207 takes precedence; algorithms G06F30/00
• CPC Class Codes: H01L 23/53228 : the principal metal being copper
• CPC Class Codes: H01L 23/53242 : the principal metal being a noble metal, e.g. gold
• CPC Class Codes: H01L 23/562 : Protection against mechanical damage H01L23/02, H01L23/28 take precedence
• CPC Class Codes: H01L 24/05 : of an individual bonding area
• CPC Class Codes: H01L 24/06 : of a plurality of bonding areas
• CPC Class Codes: H01L 24/08 : of an individual bonding area
• CPC Class Codes: H01L 24/29 : of an individual layer connector
• CPC Class Codes: H01L 24/80 : Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/053 : Oxides composed of metals from groups of the periodic table
• CPC Class Codes: H05K 1/111 : Pads for surface mounting, e.g. lay-out

Abstract

A bonded structure can include a first element having a first conductive interface feature and a second element having a second conductive interface feature. An integrated device can be coupled to or formed with the first element or the second element. The first conductive interface feature can be directly bonded to the second conductive interface feature to define an interface structure. The interface structure can be disposed about the integrated device in an at least partially annular profile to connect the first and second elements.

Claims

1. A bonded structure comprising:

a first element having a first interface feature;

a second element having a second interface feature; and

an integrated device coupled to or formed with the first element or the second element,

the first interface feature directly bonded to the second interface feature to define an interface structure, the interface structure disposed around the integrated device to define an effectively closed profile to connect the first and second elements, the effectively closed profile substantially sealing an interior region of the bonded structure from gases diffusing into the interior region.

2. The bonded structure of claim 1, wherein the first interface feature comprises a first conductive interface feature and the second interface feature comprises a second conductive interface feature.

3. The bonded structure of claim 1, wherein the effectively closed profile comprises a completely closed shape.

4. The bonded structure of claim 1, wherein the first element comprises a cap and the second element comprises a carrier, the cap bonded to the carrier to define a cavity in which the integrated device is disposed.

5. The bonded structure of claim 1, wherein the first element comprises a first integrated device die and the second element comprises a second integrated device die.

6. The bonded structure of claim 1, wherein the first interface feature comprises a plurality of conductive interface features spaced apart from one another by one or more intervening non-conductive interface features.

7. The bonded structure of claim 6, wherein the plurality of conductive interface features comprise a plurality of incompletely or completely connected conductors that collectively define an enclosed region.

8. The bonded structure of claim 6, wherein the one or more non-conductive interface features comprises silicon oxide.

9. The bonded structure of claim 1, further comprising a third interface feature spaced apart by a first spacing from the first interface feature on the first element, a first non-conductive interface feature being disposed between the first and third interface features, the first interface feature having a first width that is greater than the first spacing.

10. A bonded structure comprising:

a first element;

a second element;

an integrated device coupled to or formed within the first element or the second element; and

an interface structure disposed between the first element and the second element, the interface structure comprising a first conductive interface feature extending in a direction from the first element to the second element, a second conductive interface feature extending in a direction from the first element to the second element, and a solid state non-conductive interface feature disposed laterally between the first and second conductive interface features, the interface structure disposed about the integrated device to define an effectively closed profile to connect the first element and the second element.

11. The bonded structure of claim 10, wherein the first conductive interface feature comprises a first conductive portion on the first element and a second conductive portion on the second element, the first conductive portion being bonded to the second conductive portion.

12. The bonded structure of claim 11, wherein the first conductive portion is directly bonded to the second conductive portion without an intervening adhesive.

13. The bonded structure of claim 10, wherein the effectively closed profile comprises a complete annulus.

14. The bonded structure of claim 10, wherein the first element comprises a cap and the second element comprises a carrier, the cap bonded to the carrier to define a cavity in which the integrated device is disposed.

15. The bonded structure of claim 10, further comprising a crosswise conductor connecting the first and second conductive interface features.

16. The bonded structure of claim 10, further comprising an electrical interconnect extending through the non-conductive interface feature to provide electrical communication between the first and second elements.

17. A bonded structure comprising:

a first element;

a second element;

an integrated device coupled to or formed with the first element or the second element;

an interface structure disposed between the first element and the second element, the interface structure comprising

a first conductive interface feature laterally enclosing the integrated device, the conductive interface feature continuously extending between the first and second elements to form at least one of an electrical, mechanical, or thermal connection between the two elements, and

a non-conductive interface feature continuously extending between the first and second elements.

18. The bonded structure of claim 17, wherein the interface structure creates a hermetic seal around the integrated device.

19. The bonded structure of claim 17, wherein the first and second elements define a cavity and the interface structure hermetic seals the cavity.

20. The bonded structure of claim 17, wherein the integrated device is a sensing device.