Chassis design for wireless-charging coil integration for computing systems
First Claim
1. An apparatus, comprising:
- a computing unit, comprising;
a power receiving unit;
a conductive surface having an opening that is adjacent to the power receiving unit and a cavity extending from the opening towards a perimeter of the conductive surface, the conductive surface having a plurality of grounding point screws located away from the cavity to retain electrostatic discharge and electromagnetic interface shielding of a chassis; and
a system base coupled to the power receiving unit wherein the power receiving unit is to provide power to the system base,wherein the conductive surface and the system base are produced by a co-molding process such that a side of the conductive surface nearest to the cavity does not have ground between the system base and system ground.
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Accused Products
Abstract
This disclosure pertains to wireless power transfer systems, and in particular (but not exclusively), to techniques to improve the coupling efficiency between a power transmitting unit and a power receiving unit within a computing device. The present disclosure includes a system which comprises a computing unit which includes a power receiving unit and a conductive surface. The conductive surface has an opening that is adjacent to the power receiving unit and a slot extending from the opening towards the perimeter of the conductive surface. The computing unit further includes a system base coupled to the power receiving unit wherein the power receiving unit is to provide power to the system base. The system also includes a power transmitting unit adjacent to the computing unit.
58 Citations
20 Claims
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1. An apparatus, comprising:
a computing unit, comprising; a power receiving unit; a conductive surface having an opening that is adjacent to the power receiving unit and a cavity extending from the opening towards a perimeter of the conductive surface, the conductive surface having a plurality of grounding point screws located away from the cavity to retain electrostatic discharge and electromagnetic interface shielding of a chassis; and a system base coupled to the power receiving unit wherein the power receiving unit is to provide power to the system base, wherein the conductive surface and the system base are produced by a co-molding process such that a side of the conductive surface nearest to the cavity does not have ground between the system base and system ground. - View Dependent Claims (2, 3, 4, 5, 6, 7, 9, 10, 11, 12, 13, 14, 15, 16)
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8. A computing device, comprising:
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a non-conductive bottom cover; a conductive sheet, having an opening, adjacent to the non-conductive bottom cover and the conductive sheet having a slot extending from the opening towards a perimeter of the conductive sheet, wherein a conductive surface has a plurality of grounding point screws located away from a cavity to retain electrostatic discharge and electromagnetic interface shielding of a chassis; a power receiving unit adjacent to the conductive sheet and disposed around the perimeter of the opening; an electromagnetic shield adjacent to the power receiving unit and covering the opening of the conductive sheet; and a system base adjacent to the electromagnetic shield; wherein the conductive surface and the system base are produced by a co-molding process such that a side of the conductive surface nearest to the slot does not have ground between the system base and system ground.
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17. A system, comprising:
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a computing unit, comprising; a power receiving unit; a conductive surface having an opening that is adjacent to the power receiving unit and a cavity extending from the opening towards a perimeter of the conductive surface, the conductive surface having a plurality of grounding point screws located away from the cavity to retain electrostatic discharge and electromagnetic interface shielding of a chassis; and a system base coupled to the power receiving unit wherein the power receiving unit is to provide power to the system base; wherein the conductive surface and the system base are produced by a co-molding process such that a side of the conductive surface nearest to the cavity does not have ground between the system base and system ground; and a power transmitting unit adjacent to the computing unit. - View Dependent Claims (18, 19, 20)
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Specification