Magnetic interference avoidance in resistive sensors

• US 10,006,820 B2
• Filed: 03/08/2016
• Issued: 06/26/2018
• Est. Priority Date: 03/08/2016
• Status: Active Grant

• Current Assignee: Apple Inc.
• Original Assignee: Apple Inc.
• Inventors: Vosgueritchian, Michael, Filiz, Sinan, Smith, John Stephen, Bhuyan, Anshuman, Pedder, James E., Garg, Vikram
• Primary Examiner(s): Patel, Harshad R
• Assistant Examiner(s): DAVIS HOLLINGTON, OCTAVIA L
• Application Number:
  US15/063,985
• Publication Number:
  US 20170261387A1
• Time in Patent Office: 840 Days
• Field of Search: 73779, 73862627
• CPC Class Codes: G01B 7/18 using change in resistance
• CPC Class Codes: G01L 1/2268 Arrangements for correcting or for compensating unwanted effects
• CPC Class Codes: G01L 1/2287 constructional details of the strain gauges adjustable resistors H01C10/00
• CPC Class Codes: G06F 2203/04103 Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
• CPC Class Codes: G06F 2203/04105 Pressure sensors for measuring the pressure or force exerted on the touch surface without providing the touch position
• CPC Class Codes: G06F 3/00 Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
• CPC Class Codes: G06F 3/04144 using an array of force sensing means position sensing using the local deformation of sensor cells G06F3/0447
• CPC Class Codes: G06F 3/0418 for error correction or compensation, e.g. based on parallax, calibration or alignment

Abstract

A strain-responsive sensor incorporating a strain-sensitive element is disclosed. The strain-sensitive element includes a matched-pair of resistive structures disposed on opposite sides of a substrate. One resistive structure of the matched pair is coupled to a crossover, either a physical crossover or a soft crossover, such that current within the resistive structures of the matched pair flows in the same direction.

Claims

1. A strain-responsive sensor comprising:

a planar substrate comprising;

a first surface; and

a second surface opposite the first surface; and

a strain-sensitive element comprising;

a first resistive structure disposed on the first surface following a first open-loop path;

a second resistive structure mirroring the first resistive structure, disposed on the second surface following a second open-loop path; and

a crossover electrically coupling the first resistive structure to the second resistive structure to define a single closed-loop structure that directs current through the first and second resistive structures in a same direction.

2. The strain-responsive sensor of claim 1, wherein the first resistive structure is formed from at least one of indium tin oxide, Constantan, Karma alloys, or isoelastic alloys.

3. The strain-responsive sensor of claim 1, wherein the second open-loop path mirrors the first open loop path.

4. The strain-responsive sensor of claim 1, wherein the crossover is a physical crossover.

5. The strain-responsive sensor of claim 1, wherein the crossover is a soft crossover.

6. The strain-responsive sensor of claim 1, wherein:

the first resistive structure comprises;

a drive lead; and

a sense lead; and

the drive lead is shared with a third resistive structure.

7. The strain-responsive sensor of claim 1, wherein the strain-sensitive element is a member of a group of strain-sensitive elements.

8. The strain-responsive sensor of claim 1, further comprising:

a first reference resistor; and

a second reference resistor;

wherein

the first resistive structure, the second resistive structure, the first reference resistor, and the second reference resistor are coupled in a balancing network.

9. The strain-responsive sensor of claim 8, wherein the electrical circuit is configured to measure a voltage output from the balancing network.

10. An input sensor comprising:

a planar substrate comprising;

an upper surface; and

a lower surface opposite the upper surface;

a strain-responsive sensor comprising an array of strain-sensitive elements, each strain-sensitive element comprising;

an upper resistive structure disposed on the upper surface following a first open-loop path;

a lower resistive structure disposed on the lower surface opposite the upper resistive structure and following a second open-loop path mirroring the first open-loop path; and

a crossover electrically coupling the lower resistive structure to the upper resistive structure to define a single closed-loop structure;

wherein;

a first pair of upper resistive structures are configured to share a drive lead;

a second pair of lower resistive structures are configured to share a drive lead.

11. The input sensor of claim 10, wherein the substrate is formed from at least one of glass, polyamide, polyethylene terephthalate.

12. The input sensor of claim 10, wherein at least one upper resistive structure has a spiral shape.

13. The input sensor of claim 10, wherein each upper resistive structure is formed from the same material.

14. The input sensor of claim 13, wherein each lower resistive structure is formed from the same material.

15. The input sensor of claim 10, wherein the substrate is coupled to a display of an electronic device.

16. The input sensor of claim 10, wherein the crossover is a physical crossover.

17. A method of operating a strain-responsive sensor comprising a mirrored pair of resistive structures disposed on opposite sides of a planar substrate, each resistive structure following an open-loop path, the method comprising:

applying a voltage across the strain-responsive sensor such that current flows through the mirrored pair of resistive structures in a closed loop defined from a reference frame normal to the substrate;

measuring an output voltage of a balancing network electrically coupled to the mirrored pair of resistive structures; and

associating the measured output voltage with an amount of strain experienced by one or both resistive structures of the mirrored pair of resistive structures.

18. The method of claim 17, further comprising associating the amount of strain with an amount of force applied to the strain-responsive sensor.

19. The method of claim 17, further comprising associating the amount of strain experienced by one or both of the resistive structures of the mirrored pair of resistive structures with an amount of force applied to the strain-responsive sensor.

20. The method of claim 17, wherein both resistive structures of the mirrored pair of resistive structures are formed from a same material.