Three-dimensional (3D) photonic chip-to-fiber interposer

• US 10,007,061 B2
• Filed: 04/19/2017
• Issued: 06/26/2018
• Est. Priority Date: 05/04/2015
• Status: Active Grant

• Current Assignee: Huawei Technologies Co., Ltd. (Huawei Investment & Holding Co., Ltd.)
• Original Assignee: Huawei Technologies Co., Ltd. (Huawei Investment & Holding Co., Ltd.)
• Inventors: Jiang, Jia
• Primary Examiner(s): Hollweg, Thomas A
• Assistant Examiner(s): Anderson, Guy
• Application Number:
  US15/491,441
• Publication Number:
  US 20170219772A1
• Time in Patent Office: 433 Days
• Field of Search: 385 27- 31, 385 43, 385 49- 52
• CPC Class Codes: C23C 14/042 using masks
• CPC Class Codes: C23C 14/18 on other inorganic substrates
• CPC Class Codes: C23C 14/48 Ion implantation
• CPC Class Codes: C23C 14/541 Heating or cooling of the substrates
• CPC Class Codes: C23C 14/542 Controlling the film thickness or evaporation rate
• CPC Class Codes: C23C 14/584 Non-reactive treatment
• CPC Class Codes: C23C 14/5873 Removal of material
• CPC Class Codes: G02B 6/12004 Combinations of two or more optical elements
• CPC Class Codes: G02B 6/1228 Tapered waveguides, e.g. integrated spot-size transformers for coupling with fibres G02B6/305
• CPC Class Codes: G02B 6/1342 using diffusion diffusion in single crystals C30B31/00; diffusion in glass C03C23/00
• CPC Class Codes: G02B 6/26 Optical coupling means G02B6/36, G02B6/42 take precedence
• CPC Class Codes: G02B 6/305 and having an integrated mode-size expanding section, e.g. tapered waveguide
• CPC Class Codes: G02B 6/36 Mechanical coupling means G02B6/255, G02B6/42 take precedence
• CPC Class Codes: G02B 6/423 using guiding surfaces for the alignment

Abstract

A method of fabricating an optical coupling device, comprising forming a waveguide mask layer on a substrate platform, wherein the waveguide mask layer comprises an array of openings comprising a first end and a second end opposite to the first end, immersing the substrate platform into a salt melt comprising ions to form an array of waveguides in the substrate platform through an ion diffusion process, and controlling a rate of immersion such that a diffusion depth of the ions varies as a function of a distance in a direction from the first end to the second end, wherein the array of waveguides extends in the direction from the first end to the second end.

Claims

1. A method of fabricating an optical coupling device, comprising:

forming a waveguide mask layer on a surface of a substrate platform, the waveguide mask layer comprising an array of openings including a first end and a second end opposite to the first end, the forming the waveguide mask layer comprising tapering down a first width of each of the openings from the first end to the second end;

immersing the substrate platform into a salt melt comprising ions to form an array of waveguides in the substrate platform through an ion diffusion process, the array of waveguides corresponding to the array of openings; and

controlling a rate of the immersing such that a diffusion depth of the ions varies as a function of a distance in a direction from the first end to the second end, the array of waveguides extending in the direction from the first end to the second end, the controlling the rate of immersing comprising;

exposing the first end to the ions for a longer duration than the second end to cause a height of the array of waveguides to taper down in a direction from the first end to the second end, the tapered down first width of each of the openings causing a second width of a respective one of the waveguides to taper down in the direction from the first end to the second end.

2. The method of claim 1, further comprising arranging the array of openings in a fan-in configuration that fans inward towards the second end, so that the array of waveguides comprises an array pitch that decreases in a direction from the first end to the second end.

3. The method of claim 1, further comprising constructing the substrate platform from a glass substrate.

4. The method of claim 1, wherein the substrate platform is a sodium-rich glass substrate comprising sodium (Na⁺) ions, wherein the ions in the salt melt comprise silver ions (Ag⁺), and wherein the ion diffusion process comprises replacing at least some of the Na⁺ ions in the substrate platform with the Ag⁺ ions in the salt melt.

5. The method of claim 1, wherein the substrate platform comprises Group III-V material ions, wherein the ions in the salt melt comprise silver (Ag⁺) ions, cesium (Cs⁺) ions, rubidium (Rb⁺) ions, lithium (Li⁺) ions, potassium (K⁺) ions or thallium (Tl⁺) ions, and wherein the ion diffusion process comprises replacing at least some of the Group III-V material ions in the substrate platform with the ions in the salt melt.

6. The method of claim 1, further comprising controlling a temperature gradient of the salt melt such that the salt melt comprises a temperature that increases with increasing depth of the salt melt.

7. The method of claim 1, further comprising controlling a concentration of the ions in the salt melt such that the concentration of the ions increases with increasing depth of the salt melt.

8. The method of claim 1, further comprising forming a top cladding layer on the array of waveguides.

9. A method of fabricating an optical coupling device, the method comprising:

forming a waveguide mask layer on a first surface of a substrate platform, the substrate platform comprising a second surface adjacent to the first surface, a third surface adjacent to the first surface, and opposite to and parallel with the second surface, and a fourth surface adjacent to the second and third surfaces and opposite the first surface, the waveguide mask layer comprising an array of openings extending across the first surface of the substrate platform from the second surface of the substrate platform to the third surface of the substrate platform; and

forming an array of waveguides in the substrate platform corresponding to the array of openings in the waveguide mask layer, the array of waveguides comprising ion channels formed using only a single masking process and extending from the second surface of the substrate platform to the third surface of the substrate platform;

the array of waveguides formed with an array pitch with a large pitch end at the second surface of the substrate platform and a small pitch end at the third surface of the substrate platform; and

each of the waveguides formed with a truncated cone-shaped structure that tapers down parallel to and perpendicular to the first surface from the large pitch end to the small pitch end.

10. The method of claim 9, wherein forming the array of waveguides comprises using an ion-exchange process.

11. The method of claim 10, wherein forming the array of waveguides comprises controlling an ion exchange rate such that a diffusion depth of ions in each waveguides varies as a function of a distance in a direction from the second surface to the third surface.

12. The method of claim 9, wherein forming the array of waveguides comprises using an ion-implantation process.

13. The method of claim 9, wherein the substrate platform comprises a sodium-rich glass substrate comprising sodium (Na⁺) ions, and the waveguides comprise silver (Ag⁺) ions.

14. The method of claim 9, wherein the substrate platform comprises Group III-V material ions, and wherein the waveguides comprise silver (Ag⁺) ions, cesium (Cs⁺) ions, rubidium (Rb⁺) ions, lithium (Li⁺) ions, potassium (K⁺) ions or thallium (Tl⁺) ions.

15. The method of claim 9, wherein forming the array of waveguides comprises:

removing the waveguide mask layer from the first surface of the substrate platform; and

applying an electrical field to the substrate platform to bury the array of waveguides in the substrate platform away from the first surface and the fourth surface.

16. The method of claim 9, further comprising forming a top cladding layer on the array of waveguides.

17. The method of claim 9, further comprising forming the waveguides spaced further apart at the second surface of the substrate platform than at the third surface of the substrate platform.

18. The method of claim 9, further comprising forming each waveguide with a single-mode fiber (SMF) mode size at the second surface of the substrate platform, and with a submicron silicon (Si) waveguide mode size at the third surface of the substrate platform.

19. The method of claim 9, wherein forming the array of waveguides comprises using an ion diffusion process.

20. The method of claim 9, wherein forming the array of waveguides comprises using an ultraviolet (UV) light writing process.