Bezel structure of touch screen and method for manufacturing the same, touch screen and display device
First Claim
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1. A bezel structure of a touch screen, the touch screen being provided with a substrate, and the bezel structure comprising:
- a black matrix portion only provided on a single edge region on a back surface of the substrate;
a bonding area arranged on the black matrix portion and provided with a plurality of metal leads and a plurality of transparent conductive solder pads, each of the plurality of transparent conductive solder pads being electrically connected with corresponding one metal lead of the plurality of metal leads;
a first insulating photoresist layer arranged between the plurality of transparent conductive solder pads and the plurality of metal leads in a thickness direction of the substrate, the transparent conductive solder pads being electrically connected with corresponding metal leads via jumper holes provided in the first insulating photoresist layer; and
a plurality of transparent conductive edge-routing wires arranged on the back surface of the substrate, at both lateral sides thereof adjacent to the end side, each of the plurality of transparent conductive edge-routing wires extending to the bonding area and being constructed at a terminal end thereof as corresponding one of the plurality of transparent conductive solder pads located within the bonding area.
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Abstract
A bezel structure of a touch screen is disclosed by the invention. A touch screen having the bezel structure, a display device having the touch screen, and a method for manufacturing the bezel structure of the touch screen are also disclosed by the invention.
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Citations
20 Claims
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1. A bezel structure of a touch screen, the touch screen being provided with a substrate, and the bezel structure comprising:
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a black matrix portion only provided on a single edge region on a back surface of the substrate; a bonding area arranged on the black matrix portion and provided with a plurality of metal leads and a plurality of transparent conductive solder pads, each of the plurality of transparent conductive solder pads being electrically connected with corresponding one metal lead of the plurality of metal leads; a first insulating photoresist layer arranged between the plurality of transparent conductive solder pads and the plurality of metal leads in a thickness direction of the substrate, the transparent conductive solder pads being electrically connected with corresponding metal leads via jumper holes provided in the first insulating photoresist layer; and a plurality of transparent conductive edge-routing wires arranged on the back surface of the substrate, at both lateral sides thereof adjacent to the end side, each of the plurality of transparent conductive edge-routing wires extending to the bonding area and being constructed at a terminal end thereof as corresponding one of the plurality of transparent conductive solder pads located within the bonding area. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method for manufacturing a bezel structure of a touch screen, the touch screen being provided with a substrate, and the method comprising steps of:
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forming a black matrix portion only provided on a single edge region on a back surface of the substrate, the black matrix portion being adapted to be formed with a bonding area thereon; forming a plurality of transparent conductive edge-routing wires arranged on the back surface of the substrate, at both lateral sides thereof adjacent to the end side, each of the plurality of transparent conductive edge-routing wires extending to the bonding area and being constructed at a terminal end thereof as corresponding one of a plurality of transparent conductive solder pads located within the bonding area; forming a first insulating photoresist layer on the back surface of the substrate, the first insulating photoresist layer being formed with jumper holes and each of the jumper holes being positioned at a site where each of the transparent conductive solder pads is located; and disposing a plurality of metal leads on the bonding area; wherein each of the transparent conductive solder pads is electrically connected with a corresponding metal leads via a jumper hole. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20)
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Specification