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Capacitive sensor packaging

  • US 10,007,833 B2
  • Filed: 08/23/2017
  • Issued: 06/26/2018
  • Est. Priority Date: 05/18/2012
  • Status: Active Grant
First Claim
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1. An assembly for an electronic device, comprising:

  • a device housing including an opening;

    a fingerprint sensor;

    plastic molded above the fingerprint sensor, the plastic defining a button structure disposed to fit in the opening;

    a switch stacked vertically below the fingerprint sensor; and

    a support plate positioned between the fingerprint sensor and the switch.

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