×

Methods for surface attachment of flipped active components

  • US 10,008,465 B2
  • Filed: 02/02/2017
  • Issued: 06/26/2018
  • Est. Priority Date: 06/08/2011
  • Status: Active Grant
First Claim
Patent Images

1. An active component, comprising:

  • a circuit structure having a post surface and an opposing stamp surface, the circuit structure including an electronic circuit;

    a plurality of electrically conductive connection posts protruding from the post surface, wherein the connection posts are physically connected to the circuit structure and electrically connected to the electronic circuit; and

    a fractured component tether physically connected to the circuit structure.

View all claims
  • 5 Assignments
Timeline View
Assignment View
    ×
    ×