Methods for surface attachment of flipped active components
First Claim
1. An active component, comprising:
- a circuit structure having a post surface and an opposing stamp surface, the circuit structure including an electronic circuit;
a plurality of electrically conductive connection posts protruding from the post surface, wherein the connection posts are physically connected to the circuit structure and electrically connected to the electronic circuit; and
a fractured component tether physically connected to the circuit structure.
5 Assignments
0 Petitions
Accused Products
Abstract
An active substrate includes a plurality of active components distributed over a surface of a destination substrate, each active component including a component substrate different from the destination substrate, and each active component having a circuit and connection posts on a process side of the component substrate. The connection posts may have a height that is greater than a base width thereof, and may be in electrical contact with the circuit and destination substrate contacts. The connection posts may extend through the surface of the destination substrate contacts into the destination substrate connection pads to electrically connect the connection posts to the destination substrate contacts.
-
Citations
22 Claims
-
1. An active component, comprising:
-
a circuit structure having a post surface and an opposing stamp surface, the circuit structure including an electronic circuit; a plurality of electrically conductive connection posts protruding from the post surface, wherein the connection posts are physically connected to the circuit structure and electrically connected to the electronic circuit; and a fractured component tether physically connected to the circuit structure. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
-
-
13. A wafer comprising:
-
a circuit structure having a post surface and an opposing stamp surface, the circuit structure including an electronic circuit; a plurality of electrically conductive connection posts protruding from the post surface, wherein the connection posts are physically connected to the circuit structure and electrically connected to the electronic circuit; and a breakable component tether releasably attaching the circuit structure to the wafer.
-
-
14. A printed structure comprising:
-
a destination substrate; one or more active components on the destination substrate, each active component having a post surface and an opposing stamp surface and comprising a plurality of conductive connection posts protruding from the post surface and a broken tether; and wherein the destination substrate has two or more electrical contacts and each connection post extends into or through an electrical contact of the destination substrate to electrically connect the electrical contacts to the connection posts. - View Dependent Claims (15, 16, 17, 18, 19, 20, 21, 22)
-
Specification