Light emitter devices and methods with reduced dimensions and improved light output

• US 10,008,637 B2
• Filed: 12/06/2011
• Issued: 06/26/2018
• Est. Priority Date: 12/06/2011
• Status: Active Grant

• Current Assignee: Creeled Incorporated
• Original Assignee: CREE Incorporated (Wolfspeed, Inc.)
• Inventors: Britt, Jeffrey C., Emerson, David T., Rosado, Raymond, Lydon, Justin
• Primary Examiner(s): Kryukova, Erin
• Application Number:
  US13/312,518
• Publication Number:
  US 20130141920A1
• Time in Patent Office: 2,394 Days
• Field of Search: 36231101, 36231115, 362335, 36224902, 257 98- 99
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/20 with a particular shape, e.g. curved or truncated substrate
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/58 Optical field-shaping elements

Abstract

Light emitter devices and methods with reduced dimensions and improved light output are provided. In one embodiment, a light emitter device includes a submount having an area of approximately 6 square millimeters (mm²) or less. The device can further include a light emitting chip on the submount and a lens disposed over the light emitting chip and positioned on the submount. The device can be operable for emitting light at approximately 100 lumens or higher.

Claims

1. A light emitter device comprising:

a submount having a surface comprising a length, a width, and a planar surface area of 6 square millimeters (mm²) or less;

first and second electrical elements disposed over the upper surface of the submount;

a light emitting chip disposed over the submount, wherein the light emitting chip electrically communicates with the first and second electrical elements, and wherein the first and second electrical elements extend radially outwardly from a center of the submount and around each edge of the light emitting chip, so as to extend towards each edge of the submount to occupy a majority of the planar surface area; and

a lens formed over the light emitting chip and the submount from a material and/or encapsulant dispensed over the submount and light emitting chip in liquid form, wherein the lens comprises a circular lens base, a substantially solid hemispheric portion extending above the circular lens base, and a protective layer extending around the circular lens base, wherein the circular lens base comprises a circular diameter of a constant value in all directions coplanar with the circular lens base, wherein the circular diameter is substantially equal to the length or the width of the submount for maximizing light extraction therefrom;

wherein substantially all of the planar upper surface of the submount located radially inside the circular lens base is occupied by the first and second electrical elements;

wherein a portion of each of the first and second electrical elements extends along the planar upper surface outside the circular lens base towards a respective edge of the planar upper surface;

wherein the light emitter device is operable for emitting light at 100 lumens or more at 350 milliamps (mA); and

wherein the light emitter device has a maximum height of 1.85 mm.

2. The light emitter device of claim 1, wherein the lens comprises an apex centrally disposed above a center of the submount.

3. The light emitter device of claim 1, wherein the lens comprises an apex located off-center with respect to the submount.

4. The light emitter device of claim 1, wherein the lens comprises more than one apex, each of which are of equal height.

5. The light emitter device of claim 1, wherein the light emitting chip has a width of 0.85 mm or less in at least two directions.

6. The light emitter device of claim 1, wherein the light emitting chip has a thickness of 0.34 mm or less.

7. The light emitter device of claim 1, wherein the lens has a radius of 1.0 mm or more.

8. The light emitter device of claim 1, wherein a ratio of a width of the light emitting chip to a width of the submount is 0.35 or less.

9. The light emitter device of claim 1, wherein a ratio of a width of the lens to a width of the submount is 0.85 or more.

10. The light emitter device of claim 1, wherein a ratio of a planar surface area of the circular lens base to the surface area of the submount is 0.63 or more.

11. The light emitter device of claim 1, wherein a ratio of a width of the light emitting chip to a width of the lens is 0.4 or less.

12. The light emitter device of claim 1, wherein the light emitter device has an edge exclusion between the lens and an edge of the submount of between 0.3 and zero (0) mm.

13. The light emitter device of claim 12, wherein the light emitter device has an edge exclusion of zero (0) such that the lens extends all the way to at least one edge of the submount.

14. The light emitter device of claim 13, wherein the light emitter device has an edge exclusion of zero (0) on more than one edge of the submount such that the lens extends all the way to at least two or more different edges of the submount.

15. The light emitter device of claim 1, wherein the light emitter device comprises four lateral side edges and an edge exclusion of zero (0) for each lateral side edge of the submount such that the lens extends all the way to each lateral side edge of the submount.

16. The light emitter device of claim 1, wherein the device further comprises top side electrical contacts.

17. A light emitter device comprising:

a submount having a surface comprising a planar surface area of less than 6 mm²;

first and second electrical elements disposed over the surface of the submount, wherein the first and second electrical elements radially extend from a center of the submount so as to extend towards each edge of the submount and to occupy a majority of the planar surface area;

a light emitting chip over the submount and electrically connected to the first and second electrical elements; and

a lens formed over the light emitting chip and the submount from a material and/or encapsulant dispensed over the submount and light emitting chip in liquid form, wherein the lens comprises a circular lens base having a circular diameter of a constant value in all directions coplanar with the circular lens base, a substantially solid hemispheric portion extending above the circular lens base, and a protective layer extending around the circular lens base;

wherein substantially all of the planar upper surface of the submount located radially inside the circular lens base is occupied by the first and second electrical elements;

wherein a portion of each of the first and second electrical elements extends along the planar upper surface outside the circular lens base towards a respective edge of the planar upper surface;

wherein portions of the protective layer that are disposed between a diameter of the lens and an edge of the submount comprise a length measuring between 0.3 and zero (0) mm for maximizing light extraction; and

wherein the light emitter device is operable for emitting light at 100 lumens or more at 350 milliamps (mA).

18. The device of claim 17, wherein the submount comprises a width of 2.5 mm or less and a length of 2.5 mm or less.

19. The device of claim 17, wherein the lens comprises an apex centrally disposed above a center of the submount.

20. The device of claim 17, wherein the lens comprises an apex located off-center with respect to the submount.

21. The device of claim 17, wherein the lens comprises more than one apex, each of which are of equal height.

22. The device of claim 17, wherein the light emitting chip has a width of 0.85 mm or less in at least two directions.

23. The device of claim 17, wherein the light emitting chip has a thickness of 0.34 mm or less.

24. The device of claim 17, wherein the lens has a radius of 1.0 mm or more.

25. The device of claim 17, wherein the light emitter device has a height of 1.85 mm or less.

26. The device of claim 17, wherein the circular diameter of the circular lens base is equal to a length or a width of the submount.

27. The device of claim 26, wherein the circular diameter of the circular lens base is equal to a length and a width of the submount.

28. The device of claim 17, wherein the light emitter device comprises four lateral side edges and an edge exclusion of zero (0) for each lateral side edge of the submount such that the lens extends all the way to each lateral side edge of the submount.

29. The device of claim 17, wherein the device further comprises top side electrical contacts.

30. A light emitter device comprising:

a submount having a surface area of less than 6 mm²;

a light emitting chip on the submount; and

a lens formed over the light emitting chip and the submount from a material and/or encapsulant dispensed over the submount and light emitting chip in liquid form, wherein the lens comprises a circular lens base, a substantially solid hemispheric portion extending above the circular lens base, and a protective layer extending around the circular lens base, wherein the circular lens base comprises a circular diameter of a constant value in all directions coplanar with the circular lens base, wherein the circular diameter is substantially equal to a length or a width of the submount for maximizing light extraction therefrom;

wherein substantially all of the planar upper surface of the submount located radially inside the circular lens base is occupied by first and second electrical elements;

wherein a portion of each of the first and second electrical elements extends along the planar upper surface outside the circular lens base towards a respective edge of the planar upper surface;

wherein a first ratio of a width of the light emitting chip to a width of the submount is 0.35 or less;

wherein a second ratio of a surface area of the circular lens base to a surface area of the submount is 0.63 or more; and

wherein a third ratio of a width of the light emitting chip to the diameter of the lens is 0.4 or less; and

wherein the light emitter device is operable for emitting light at 100 lumens or more at 350 milliamps (mA).

31. The device of claim 30, wherein the lens comprises an apex centrally disposed above a center of the submount.

32. The device of claim 30, wherein the device further comprises top side electrical contacts.

33. A method of providing light from a light emitter device, the method comprising:

providing a light emitter device comprising;

a submount having a length, a width, and a surface area of 6 mm² or less;

a light emitting chip on the submount, wherein the light emitting chip comprises beveled sides extending from a base of the chip, wherein the light emitting chip is electrically connected to first and second electrical elements that radially extend outwardly from a center of the submount and around each edge of the light emitting chip, so as to extend towards each edge of the submount to occupy a majority of the planar surface area; and

a lens formed over the light emitting chip and the submount from a material and/or encapsulant dispensed over the submount and light emitting chip in liquid form, wherein the lens comprises a circular lens base, a substantially solid hemispheric portion extending above the circular lens base, and a protective layer extending around the circular lens base, wherein the circular lens base comprises a constant diameter of a constant value in all directions coplanar with the circular lens base, wherein the circular diameter is substantially equal to the length or the width of the submount for maximizing light extraction therefrom;

wherein the light emitter device has a maximum height of 1.85 mm; and

wherein substantially all of the planar upper surface of the submount located radially inside the circular lens base is occupied by the first and second electrical elements;

wherein a portion of each of the first and second electrical elements extends along the planar upper surface outside the circular lens base towards a respective edge of the planar upper surface; and

emitting light from the light emitter device with a light output of 100 lumens or higher at 350 milliamps (mA).

34. The method of claim 33, wherein the lens comprises an apex centrally disposed above a center of the submount.

35. The method of claim 33, wherein the lens comprises an apex located off-center with respect to the submount.

36. The method of claim 33, wherein the lens comprises more than one apex, each of which are of equal height.

37. The method of claim 33, wherein the light emitting chip has a width of 0.85 mm or less in at least two directions.

38. The method of claim 33, wherein the light emitting chip has a thickness of 0.34 mm or less.

39. The method of claim 33, wherein the circular lens base has a radius of 1.0 mm or more.

40. The method of claim 33, wherein a ratio of a width of the light emitting chip to the width of the submount is 0.35 or less.

41. The method of claim 33, wherein a ratio of the circular diameter of the circular lens base to the width of the submount is 0.9 or more.

42. The method of claim 33, wherein a ratio of a planar surface area of the circular lens base to the planar surface area of the submount is 0.63 or more.

43. The method of claim 33, wherein a ratio of width of the light emitting chip to a diameter of the lens is 0.4 or less.

44. The method of claim 33, wherein the light emitter device comprises top side electrical contacts.