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Optical die to database inspection

  • US 10,012,599 B2
  • Filed: 03/31/2016
  • Issued: 07/03/2018
  • Est. Priority Date: 04/03/2015
  • Status: Active Grant
First Claim
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1. A system configured to detect defects on a wafer, comprising:

  • an optical inspection subsystem comprising at least a light source and a detector, wherein the light source is configured to generate light that is directed to a wafer, and wherein the detector is configured to detect light from the wafer and to generate images responsive to the detected light; and

    one or more computer subsystems configured for;

    generating a rendered image based on information for a design printed on the wafer, wherein the rendered image is a simulation of an image generated by the optical inspection subsystem for the design printed on the wafer;

    comparing the rendered image to an optical image of the wafer generated by the optical inspection subsystem, wherein the design is printed on the wafer using a reticle; and

    detecting defects on the wafer based on results of the comparing.

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