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Wafer bonding method for use in making a MEMS gyroscope

  • US 10,012,670 B2
  • Filed: 10/20/2014
  • Issued: 07/03/2018
  • Est. Priority Date: 07/27/2012
  • Status: Active Grant
First Claim
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1. A method of making a microelectromechanical (MEMS) gyroscope, the method comprising:

  • providing a first substrate;

    processing the first substrate, comprising;

    forming a heater in a bonding area, comprising;

    depositing a conductive material on a surface having the bonding area of the first substrate; and

    patterning the conductive material so as to form the heater;

    depositing an insulating layer on the patterned heater;

    patterning the first substrate so as to form a cavity surrounded by a pillar; and

    forming a magnetic source at a surface of a first MEMS wafer inside the cavity;

    providing a second wafer that comprises a magnetic sensor;

    bonding the first and second wafers at the bonding area so as to form a wafer assembly, further comprising;

    driving current through the heater so as to raise temperature of a bonding material; and

    bonding the first and second wafer by using the bonding material at the raised temperature; and

    processing the first MEMS wafer of the wafer assembly so as to form a movable portion.

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