Wafer bonding method for use in making a MEMS gyroscope
First Claim
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1. A method of making a microelectromechanical (MEMS) gyroscope, the method comprising:
- providing a first substrate;
processing the first substrate, comprising;
forming a heater in a bonding area, comprising;
depositing a conductive material on a surface having the bonding area of the first substrate; and
patterning the conductive material so as to form the heater;
depositing an insulating layer on the patterned heater;
patterning the first substrate so as to form a cavity surrounded by a pillar; and
forming a magnetic source at a surface of a first MEMS wafer inside the cavity;
providing a second wafer that comprises a magnetic sensor;
bonding the first and second wafers at the bonding area so as to form a wafer assembly, further comprising;
driving current through the heater so as to raise temperature of a bonding material; and
bonding the first and second wafer by using the bonding material at the raised temperature; and
processing the first MEMS wafer of the wafer assembly so as to form a movable portion.
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Abstract
A method of making a MEMS gyroscope is disclosed herein, wherein the MEMS gyroscope comprised a magnetic sensing mechanism on a magnetic sensor wafer and a magnetic source on a MEMS wafer that further comprises a proof-mass.
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Citations
6 Claims
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1. A method of making a microelectromechanical (MEMS) gyroscope, the method comprising:
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providing a first substrate; processing the first substrate, comprising; forming a heater in a bonding area, comprising; depositing a conductive material on a surface having the bonding area of the first substrate; and patterning the conductive material so as to form the heater; depositing an insulating layer on the patterned heater; patterning the first substrate so as to form a cavity surrounded by a pillar; and forming a magnetic source at a surface of a first MEMS wafer inside the cavity; providing a second wafer that comprises a magnetic sensor; bonding the first and second wafers at the bonding area so as to form a wafer assembly, further comprising; driving current through the heater so as to raise temperature of a bonding material; and bonding the first and second wafer by using the bonding material at the raised temperature; and processing the first MEMS wafer of the wafer assembly so as to form a movable portion. - View Dependent Claims (2, 3, 4, 5, 6)
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Specification