Method of inspecting a specimen and system thereof
First Claim
1. A computer-based inspection unit configured to operate in conjunction with an inspection machine unit, the inspection unit comprising:
- a memory; and
a processor, operatively coupled with the memory, to;
obtain location information indicative of coordinates of a potential defect of interest revealed in a specimen and of one or more inspected layers of the specimen corresponding to the potential defect of interest;
send, to a computer-based and online connected die layout clipping unit, a first data indicative of the location information and dimensions of an inspection area containing the potential defect of interest; and
receive, from the die layout clipping unit, a die layout clip generated in accordance with the first data, wherein the die layout clip comprises information indicative of one or more patterns characterizing the inspection area;
determine at least one inspection algorithm of the inspection area of the specimen based upon the one or more patterns characterizing the inspection area in the die layout clip received, wherein the at least one inspection algorithm is associated with an inspection of a semiconductor wafer corresponding to the specimen by the inspection machine unit; and
send a second data specify the at least one inspection algorithm determined by the processor to the inspection machine unit.
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Accused Products
Abstract
There is provided an inspection system for inspecting a specimen, an inspection unit capable to operate in conjunction with an inspection machine unit, a die layout clipping unit, methods of inspecting a specimen, and a method of providing a die layout clip. The method of inspecting a specimen comprises: obtaining location information indicative of coordinates of a potential defect of interest revealed in the specimen and of one or more inspected layers corresponding to the potential defect of interest; sending to a die layout clipping unit a first data indicative of the location information and dimensions of an inspection area containing the potential defect of interest; receiving a die layout clip generated in accordance with the first data; specifying at least one inspection algorithm of the inspection area using information comprised in the die layout clip; and enabling inspection of the inspection area using the specified inspection algorithm.
15 Citations
14 Claims
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1. A computer-based inspection unit configured to operate in conjunction with an inspection machine unit, the inspection unit comprising:
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a memory; and a processor, operatively coupled with the memory, to; obtain location information indicative of coordinates of a potential defect of interest revealed in a specimen and of one or more inspected layers of the specimen corresponding to the potential defect of interest; send, to a computer-based and online connected die layout clipping unit, a first data indicative of the location information and dimensions of an inspection area containing the potential defect of interest; and receive, from the die layout clipping unit, a die layout clip generated in accordance with the first data, wherein the die layout clip comprises information indicative of one or more patterns characterizing the inspection area; determine at least one inspection algorithm of the inspection area of the specimen based upon the one or more patterns characterizing the inspection area in the die layout clip received, wherein the at least one inspection algorithm is associated with an inspection of a semiconductor wafer corresponding to the specimen by the inspection machine unit; and send a second data specify the at least one inspection algorithm determined by the processor to the inspection machine unit. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A computer-implemented method of inspecting a specimen, the method comprising:
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obtaining, by a computer-based inspection unit, location information indicative of coordinates of a potential defect of interest revealed in the specimen and of one or more inspected layers of the specimen corresponding to the potential defect of interest; sending, by the inspection unit, to a computer-based and online connected die layout clipping unit a first data indicative of the location information and dimensions of an inspection area containing the potential defect of interest; receiving, by the inspection unit, from the die layout clipping unit a die layout clip generated in accordance with the first data, wherein the die layout clip comprises information indicative of one or more patterns characterizing the inspection area; determining, by the inspection unit, at least one inspection algorithm of the inspection area based upon the one or more patterns characterizing the inspection area in the die layout clip, wherein the at least one inspection algorithm is associated with an inspection of a semiconductor wafer corresponding to the specimen; and enabling, by the inspection unit, inspection of the inspection area of the specimen using the at least one inspection algorithm. - View Dependent Claims (9, 10, 11, 12, 13)
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14. A non-transitory computer readable storage medium including instructions that, when executed by a processor, cause the processor to perform operations for inspecting a specimen, the operations comprising:
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obtaining location information indicative of coordinates of a potential defect of interest revealed in the specimen and of one or more inspected layers of the specimen corresponding to the potential defect of interest; sending to a computer-based and online connected die layout clipping unit a first data indicative of the location information and dimensions of an inspection area containing the potential defect of interest; receiving from the die layout clipping unit a die layout clip generated in accordance with the first data, wherein the die layout clip comprises information indicative of one or more patterns characterizing the inspection area; determining at least one inspection algorithm of the inspection area based upon the one or more patterns characterizing the inspection area in the die layout clip, wherein the at least one inspection algorithm is associated with an inspection of a semiconductor wafer corresponding to the specimen; and enabling inspection of the inspection area of the specimen using the at least one inspection algorithm.
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Specification