Fingerprint recognition apparatus

• US 10,013,596 B2
• Filed: 07/07/2016
• Issued: 07/03/2018
• Est. Priority Date: 07/31/2015
• Status: Active Grant

• Current Assignee: Superc-Touch Corporation
• Original Assignee: Superc-Touch Corporation
• Inventors: Lee, Hsiang-Yu, Chin, Shang, Lin, Ping-Tsun
• Primary Examiner(s): Mariam, Daniel
• Application Number:
  US15/204,388
• Publication Number:
  US 20170098113A1
• Time in Patent Office: 726 Days
• Field of Search: 382124
• CPC Class Codes: G06V 40/1306 non-optical, e.g. ultrasonic or capacitive sensing
• CPC Class Codes: G06V 40/1365 Matching; Classification

Abstract

A fingerprint recognition apparatus includes an electrode-and-wiring substrate having two main surfaces opposite to each other, where one main surface is in proximity to user finger and the electrode-and-wiring substrate has a plurality of sensing electrodes on the other main surface. The fingerprint recognition apparatus further includes an integrated circuit (IC) chip having a fingerprint sensing circuit and a plurality of metal bumps. At least part of the metal bumps are electrically connected to the fingerprint sensing circuit and corresponding sensing electrodes on the electrode-and-wiring substrate, whereby the fingerprint sensing circuit is electrically connected to the sensing electrodes.

Claims

1. A fingerprint recognition apparatus, comprising:

an electrode-and-wiring substrate having two main surfaces opposite to each other, where one main surface is in proximity to user finger and the electrode-and-wiring substrate has a plurality of sensing electrodes on the other main surface, wherein the electrode-and-wiring substrate is formed as a single plate structure, and a sensing area corresponding to the user finger is formed on the other main surface of the electrode-and-wiring substrate, and the plurality of sensing electrodes are within the sensing area; and

an integrated circuit (IC) chip having a fingerprint sensing circuit and a plurality of metal bumps, at least part of the metal bumps electrically connected with the fingerprint sensing circuit and corresponding sensing electrodes on the electrode-and-wiring substrate, whereby the fingerprint sensing circuit is electrically connected to the sensing electrodes.

2. The fingerprint recognition apparatus in claim 1, wherein an area of each of the metal bumps is not larger than an area of corresponding one of the sensing electrodes.

3. The fingerprint recognition apparatus in claim 1, wherein the electrode-and-wiring substrate further comprises a plurality of conductive pads and a plurality of conductive wires, wherein at least one of the conductive pads is electrically connected to another part of the metal bumps to transmit sensing signal of the IC chip outside the IC chip.

4. The fingerprint recognition apparatus in claim 3, wherein part of the conductive pads of the electrode-and-wiring substrate are electrically connected to a flexible printed circuit board or a rigid printed circuit board.

5. The fingerprint recognition apparatus in claim 3, further comprising an electronic device electrically connected with the electrode-and-wiring substrate, the electronic device electrically connected with the fingerprint sensing circuit of the IC chip through the conductive wires, the conductive pads and the metal bumps.

6. The fingerprint recognition apparatus in claim 1, wherein the electrode-and-wiring substrate is a glass substrate, a ceramic substrate or a sapphire substrate.

7. The fingerprint recognition apparatus in claim 6, wherein the glass substrate is a protection glass of a display apparatus.

8. The fingerprint recognition apparatus in claim 1, wherein the electrode-and-wiring substrate is a polymer film.

9. The fingerprint recognition apparatus in claim 1, wherein the IC chip has switch circuit therein to set the sensing electrodes into longitudinal sensing electrodes and transversal sensing electrodes.

10. The fingerprint recognition apparatus in claim 1, wherein the fingerprint sensing circuit is mutual-capacitance fingerprint sensing circuit or self-capacitance fingerprint sensing circuit.

11. The fingerprint recognition apparatus in claim 10, wherein the IC chip further comprises a plurality of sensing electrodes on a surface of the IC chip toward the electrode-and-wiring substrate, the sensing electrodes on the IC chip are arranged substantially perpendicular to the sensing electrodes on the electrode-and-wiring substrate, and wherein the sensing electrodes on the IC chip and the sensing electrodes on the electrode-and-wiring substrate are disposed on different planes.

12. A fingerprint recognition apparatus, comprising:

a wiring substrate having two main surfaces opposite to each other, where one main surface is in proximity to user finger and the wiring substrate has a plurality of conductive pads and conductive wires on the other main surface; and

an integrated circuit (IC) chip having a fingerprint sensing circuit, a plurality of sensing electrodes and a plurality of metal bumps, the fingerprint sensing circuit electrically connected with the sensing electrodes,

wherein the fingerprint sensing circuit is electrically connected with parts of the conductive pads and part of the conductive wires on the wiring substrate, whereby the fingerprint sensing circuit is electrically connected to an external electric circuit;

wherein the wiring substrate is formed as a single plate structure and completely covers a sensing area formed by the plurality of sensing electrodes on the integrated circuit (IC).

13. The fingerprint recognition apparatus in claim 12, wherein another part of the conductive pads of the wiring substrate are electrically connected to a flexible printed circuit board or a rigid printed circuit board.

14. The fingerprint recognition apparatus in claim 12, further comprising an electronic device electrically connected with the wiring substrate, the electronic device electrically connected with the fingerprint sensing circuit of the IC chip through the conductive wires, the conductive pads and the metal bumps.

15. The fingerprint recognition apparatus in claim 12, wherein the fingerprint sensing circuit is self-capacitance fingerprint sensing circuit.

16. The fingerprint recognition apparatus in claim 12, wherein the wiring substrate is a glass substrate, a ceramic substrate or a sapphire substrate.

17. The fingerprint recognition apparatus in claim 16, wherein the glass substrate is a protection glass of a display apparatus.

18. The fingerprint recognition apparatus in claim 12, wherein the wiring substrate is a polymer film.

19. The fingerprint recognition apparatus in claim 12, wherein the IC chip further comprises at least one balancing metal bump and the balancing metal bump is not electrically connected with the wiring substrate.