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Wireless communication module and wireless communication device

  • US 10,013,650 B2
  • Filed: 08/30/2012
  • Issued: 07/03/2018
  • Est. Priority Date: 03/03/2010
  • Status: Active Grant
First Claim
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1. A wireless communication module comprising:

  • a flexible multilayer substrate including a plurality of stacked flexible base materials and a cavity provided therein;

    a wireless IC chip disposed in the cavity;

    a sealant filled in the cavity so as to cover the wireless IC chip, the sealant being harder than the flexible base materials; and

    a loop-shaped electrode including a coil pattern provided on or in the flexible multilayer substrate, the loop-shaped electrode being coupled to the wireless IC chip;

    whereinthe coil pattern is provided outside the cavity when viewed in plan;

    the coil pattern is made of a conductive material that is harder than the flexible base materials;

    the coil pattern is wound a plurality of turns around a lateral portion of the sealant filled in the cavity; and

    a density of the coil pattern increases continuously or step-wise from an outer circumference to an inner circumference in all radial directions of the coil pattern.

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