Wireless communication module and wireless communication device

• US 10,013,650 B2
• Filed: 08/30/2012
• Issued: 07/03/2018
• Est. Priority Date: 03/03/2010
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: Murayama, Hiromi, Kato, Noboru
• Primary Examiner(s): Han, Jessica
• Assistant Examiner(s): Patel, Amal
• Application Number:
  US13/598,872
• Publication Number:
  US 20120326931A1
• Time in Patent Office: 2,133 Days
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01Q 1/2225 used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H01Q 1/2283 mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
• CPC Class Codes: H01Q 7/00 Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop

Abstract

A wireless communication module and a wireless communication device that are less likely to become detached even when attached to a flexible base substrate and have a reduced height includes a flexible multilayer substrate including a plurality of stacked flexible base materials and a cavity provided therein, a wireless IC chip arranged in the cavity, and a sealant filled in the cavity so as to cover the wireless IC chip. The sealant is a material that is harder than the flexible base materials. The flexible multilayer substrate includes a loop-shaped electrode defined by coil patterns. The loop-shaped electrode is electrically connected to the wireless IC chip.

Claims

1. A wireless communication module comprising:

a flexible multilayer substrate including a plurality of stacked flexible base materials and a cavity provided therein;

a wireless IC chip disposed in the cavity;

a sealant filled in the cavity so as to cover the wireless IC chip, the sealant being harder than the flexible base materials; and

a loop-shaped electrode including a coil pattern provided on or in the flexible multilayer substrate, the loop-shaped electrode being coupled to the wireless IC chip;

wherein

the coil pattern is provided outside the cavity when viewed in plan;

the coil pattern is made of a conductive material that is harder than the flexible base materials;

the coil pattern is wound a plurality of turns around a lateral portion of the sealant filled in the cavity; and

a density of the coil pattern increases continuously or step-wise from an outer circumference to an inner circumference in all radial directions of the coil pattern.

2. The wireless communication module according to claim 1, wherein the flexible base materials are made of a thermoplastic resin, and the sealant is made of a thermosetting resin.

3. The wireless communication module according to claim 1, wherein a depth of the cavity is greater than or equal to about half a thickness of the flexible multilayer substrate.

4. The wireless communication module according to claim 1, wherein the coil pattern includes a plurality of layers provided in the flexible multilayer substrate, and at least portions of coil patterns provided on adjacent ones of the plurality of layers do not overlap each other when viewed in plan from a coil axis direction of the coil pattern.

5. The wireless communication module according to claim 1, wherein the sealant includes a magnetic filler.

6. A wireless communication device comprising:

a wireless communication module; and

a flexible base substrate on which the wireless communication module is mounted;

wherein

the wireless communication module includes;

a flexible multilayer substrate including a plurality of stacked flexible base materials and a cavity provided therein;

a wireless IC chip disposed in the cavity;

a sealant filled in the cavity so as to cover the wireless IC chip, the sealant being harder than the flexible base materials; and

a loop-shaped electrode including a coil pattern provided on or in the flexible multilayer substrate, the loop-shaped electrode being coupled to the wireless IC chip;

the coil pattern is provided outside the cavity when viewed in plan;

the coil pattern is made of a conductive material that is harder than the flexible base materials;

the coil pattern is wound a plurality of turns around a lateral portion of the sealant filled in the cavity; and

a density of the coil pattern increases continuously or step-wise from an outer circumference to an inner circumference in all radial directions of the coil pattern.

7. The wireless communication device according to claim 6, wherein an antenna pattern is provided on the base substrate, and the antenna pattern is magnetically coupled to the loop-shaped electrode.

8. The wireless communication device according to claim 7, wherein the wireless communication module is arranged on the base substrate so that, when viewed in plan, the wireless communication module includes a first region in which the coil pattern overlaps the antenna pattern and a second region in which the coil pattern does not overlap the antenna pattern.

9. The wireless communication device according to claim 6, wherein the wireless communication module is mounted on the base substrate in a state in which an opening portion of the cavity faces the base substrate.

10. The wireless communication system according to claim 6, wherein the flexible base materials are made of a thermoplastic resin, and the sealant is made of a thermosetting resin.

11. The wireless communication system according to claim 6, wherein a depth of the cavity is greater than or equal to about half a thickness of the flexible multilayer substrate.

12. The wireless communication system according to claim 6, wherein the coil pattern includes a plurality of layers provided in the flexible multilayer substrate, and at least portions of coil patterns provided on adjacent ones of the plurality of layers do not overlap each other when viewed in plan from a coil axis direction of the coil pattern.

13. The wireless communication system according to claim 6, wherein the sealant includes a magnetic filler.