Methods for processing electronic devices

• US 10,014,177 B2
• Filed: 10/07/2013
• Issued: 07/03/2018
• Est. Priority Date: 12/13/2012
• Status: Active Grant

• Current Assignee: Corning Incorporated
• Original Assignee: Corning Incorporated
• Inventors: Bellman, Robert Alan, Bookbinder, Dana Craig, Manley, Robert George, Mazumder, Prantik, Chang, Theresa, Domey, Jeffrey John, Enicks, Darwin Gene, Ravichandran, Vasudha, Stephens, II, Alan Thomas, Thomas, John Christopher
• Primary Examiner(s): DODDS, SCOTT
• Application Number:
  US14/047,514
• Publication Number:
  US 20140166199A1
• Time in Patent Office: 1,730 Days
• Field of Search: 156 99-107, 156247-249
• CPC Class Codes: H01L 21/2007 Bonding of semiconductor wafers to insulating substrates or to semiconducting substrates using an intermediate insulating layer H01L21/2011 takes precedence; bonding of semiconductor wafers to semiconductor wafers for junction formation H01L21/187
• CPC Class Codes: H10K 2102/311 Flexible OLED
• CPC Class Codes: H10K 59/1201 Manufacture or treatment
• CPC Class Codes: H10K 71/80 using temporary substrates
• CPC Class Codes: H10K 77/111 Flexible substrates
• CPC Class Codes: Y02E 10/549 Organic PV cells
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product
• CPC Class Codes: Y10T 156/10 Methods of surface bonding and/or assembly therefor
• CPC Class Codes: Y10T 156/1052 with cutting, punching, tearing or severing

Abstract

Methods for making electronic devices on thin sheets bonded to carriers. A surface modification layer and associated heat treatments, may be provided on a sheet, a carrier, or both, to control both room-temperature van der Waals (and/or hydrogen) bonding and high temperature covalent bonding between the thin sheet and carrier during the electronic device processing. The room-temperature bonding is controlled so as to be sufficient to hold the thin sheet and carrier together during vacuum processing, wet processing, and/or ultrasonic cleaning processing, during the electronic device processing. And at the same time, the high temperature covalent bonding is controlled so as to prevent a permanent bond between the thin sheet and carrier during high temperature processing, during the electronic device processing, as well as maintain a sufficient bond to prevent delamination during high temperature processing.

Claims

1. A method of making an electronic device, comprising:

obtaining a carrier having a carrier bonding surface;

obtaining a sheet having a sheet bonding surface, the sheet comprising glass;

disposing a surface modification layer on one of the carrier bonding surface and the sheet bonding surface, wherein the surface modification layer comprises one of;

a) a plasma polymerized fluoropolymer; and

b) an aromatic silane;

bonding the carrier bonding surface with the sheet bonding surface with the surface modification layer therebetween to form an article, the surface modification layer being in contact with both the carrier bonding surface and the sheet bonding surface, so that the surface energy bonding the sheet to the carrier is of such a character that after subjecting the article to a temperature cycle by heating in an chamber cycled from room temperature to 600°

C. at a rate of 9.2°

C. per minute, held at a temperature of 600°

C. for 10 minutes, and then cooled at 1°

C. per minute to 300°

C., and then removing the article from the chamber and allowing the article to cool to room temperature, the carrier and sheet do not separate from one another if one is held and the other subjected to the force of gravity, there is no outgassing from the surface modification layer during the temperature cycle, and the sheet may be separated from the carrier without breaking the thinner one of the carrier and the sheet into two or more pieces, wherein the carrier and the sheet have different thicknesses;

disposing an electronic-device component onto the sheet.

2. The method of claim 1, adhesion energy between the carrier and the sheet is greater than about 24 mJ/m².

3. The method of claim 1, adhesion energy between the carrier and the sheet is from 50 to 1000 mJ/m².

4. A method of making an electronic device, comprising:

obtaining an article;

the article comprising;

a carrier having a carrier bonding surface;

a sheet having a sheet bonding surface, the sheet comprising glass;

a surface modification layer disposed on one of the carrier bonding surface and the sheet bonding surface;

wherein the surface modification layer comprises one of;

a) a plasma polymerized fluoropolymer; and

b) an aromatic silane,

the carrier bonding surface being bonded with the sheet bonding surface with the surface modification layer therebetween, the surface modification layer being in contact with both the carrier bonding surface and the sheet bonding surface, wherein the surface energy bonding the sheet to the carrier is of such a character that after subjecting the article to a temperature cycle by heating in an chamber cycled from room temperature to 600°

C. at a rate of 9.2°

C. per minute, held at a temperature of 600°

C. for 10 minutes, and then cooled at 1°

C. per minute to 300°

C., and then removing the article from the chamber and allowing the article to cool to room temperature, the carrier and sheet do not separate from one another if one is held and the other subjected to the force of gravity, there is no outgassing from the surface modification layer during the temperature cycle, and the sheet may be separated from the carrier without breaking the thinner one of the carrier and the sheet into two or more pieces, wherein the carrier and the sheet have different thicknesses;

disposing an electronic-device component onto the sheet.

5. The method of claim 4, wherein the electronic device component comprises an organic light emitting material.

6. The method of claim 4, wherein the disposing of the electronic-device component onto the sheet includes processing at a temperature ≥

400°

C.

7. The method of claim 4, further comprising dicing the carrier and sheet into two separate portions.

8. The method of claim 7, wherein at least one of the separate portions includes a sheet portion remaining bonded to a carrier portion.

9. The method of claim 7, further comprising further processing of the at least one of the separate portions with an additional electronic-device component.

10. The method of claim 4, further comprising removing at least one part of the sheet from the carrier, wherein the at least one part of the sheet includes the electronic device component thereon.

11. The method of claim 4, wherein the carrier comprises glass.

12. The method of claim 4, wherein the carrier without any surface modification layer has an average surface roughness Ra of ≤

2 nm.

13. The method of claim 4, wherein the carrier has a thickness of 200 microns to 3 mm.

14. The method of claim 4, wherein the sheet is glass.

15. The method of claim 4, wherein the sheet without any surface modification layer has an average surface roughness Ra of ≤

2 nm.

16. The method of claim 4, wherein the sheet has a thickness of ≤

300 microns.

17. The method of claim 4, wherein the surface modification layer has a thickness of from 0.1 to 100 nm.

18. The method of claim 4, wherein each of the carrier and the sheet is of a size 100 mm×

100 mm or larger.

19. The method of claim 4, wherein the surface modification layer comprises a plasma polymerized fluoropolymer, and the surface modification layer is one of:

plasma polymerized polytetrafluroethylene; and

a plasma polymerized fluoropolymer surface modification layer deposited from a CF4-C4F8 mixture having ≤

40% C4F8.

20. The method of claim 4, wherein the surface modification layer comprises an aromatic silane, and the surface modification layer is one of:

phenyltriethoxysilane;

diphenyldiethoxysilane; and

4-pentafluorophenyltriethoxysilane.

21. The method of claim 4, wherein the surface modification layer comprises an aromatic silane, and the surface modification layer contains chlorophenyl, or fluorophenyl, silyl groups.

22. The method of claim 4, adhesion energy between the carrier and the sheet is greater than about 24 mJ/m².

23. The method of claim 4, adhesion energy between the carrier and the sheet is from 50 to 1000 mJ/m2.