Compensation of bondwires in the microwave regime

• US 10,014,276 B2
• Filed: 02/25/2015
• Issued: 07/03/2018
• Est. Priority Date: 02/25/2015
• Status: Active Grant

• Current Assignee: the united states of america as represented by the secretary of the navy
• Original Assignee: the united states of america as represented by the secretary of the navy
• Inventors: Chieh, Jia-Chi Samuel
• Primary Examiner(s): Naraghi, Ali
• Assistant Examiner(s): SODERHOLM, KRISTA Z
• Application Number:
  US14/631,635
• Publication Number:
  US 20160247752A1
• Time in Patent Office: 1,224 Days
• CPC Class Codes: H01L 2223/6611 Wire connections
• CPC Class Codes: H01L 2224/45014 Ribbon connectors, e.g. rectangular cross-section
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48105 Connecting bonding areas at different heights
• CPC Class Codes: H01L 2224/48135 Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49 of a plurality of wire connectors
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 23/49838 Geometry or layout
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 24/85 using a wire connector wire bonding in general B23K20/004
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/00015 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed as prior art
• CPC Class Codes: H01L 2924/206 Length ranges
• CPC Class Codes: H01L 2924/207 Diameter ranges
• CPC Class Codes: H01L 2924/30107 Inductance

Abstract

A method for connecting an integrated circuit (IC) to a printed circuit board (PCB) can include the steps of fixing the IC and the PCB to a dielectric substrate. A single wire bond can be used to bond the IC to the PCB, and a ground plane can be established for the PCB. To minimize inductance losses at high frequency operation, a ground plane defect can be intentionally established by forming at least one opening in the ground plane. The opening can be rectangular when viewed in top plan, although the number of openings formed and opening geometry can be chosen according to the desired operating frequency of the device. The defect can allow for single wire bonding of the IC to the PCB in a manner which allows for high frequency operation without requiring the integration of additional matching network components on the IC and PCB.

Claims

1. A method for interfacing an IC to a PCB for a device, according to a desired operating frequency for said device, said method comprising the steps of:

A) fixing said IC to a dielectric substrate;

B) fastening said PCB to said substrate;

C) bonding said IC to said PCB with a wire bond;

D) establishing a ground plane for said PCB; and

,

E) defecting said ground plane by forming at least one rectangular opening in said ground plane, when said operating frequency is in the microwave frequency range.

2. A method for extending the operating frequency range of a device, said device having an IC and a PCB interconnected with a groundwire, and said PCB further having a ground plane, wherein said IC has an IC network inductance and said PCB has a PCB network inductance, and said method is accomplished without matching said IC network and PCB network inductances, said method comprising the step of establishing a defect in said ground plane.

3. The method of claim 2, wherein said operating device in in the microwave region and said geometry is a rectangle.

4. A device, comprising:

a dielectric substrate;

an IC fixed to said substrate;

a PCB fixed to said substrate;

a bondwire connected to said IC and to said PCB;

a ground plane electrically connected to said PCB; and

,

said ground plane formed with a defect;

wherein said defect is a rectangular opening when said device is viewed in top plan and when a desired operating frequency for said device is in the microwave region.