Method for manufacturing metallic reflector for LED package

• US 10,014,435 B2
• Filed: 05/19/2015
• Issued: 07/03/2018
• Est. Priority Date: 05/22/2014
• Status: Active Grant

• Current Assignee: Firsteng Co. Ltd.
• Original Assignee: Firsteng Co. Ltd.
• Inventors: Kim, Yung Cheon, Nam, Deok Hee, Park, Min Chul, Park, Hae Chul, Kang, Baek Won
• Primary Examiner(s): Travers, Matthew P
• Application Number:
  US14/716,313
• Publication Number:
  US 20150340545A1
• Time in Patent Office: 1,141 Days
• Field of Search: 438 26, 438 28, 438 29
• CPC Class Codes: B21D 28/02 Punching blanks or articles with or without obtaining scrap cutting nails or pins from strips or sheet material B21G3/26; Notching
• CPC Class Codes: B21D 28/32 in other articles of special shape
• CPC Class Codes: B21D 35/001 Shaping combined with punching, e.g. stamping and perforating
• CPC Class Codes: F21K 9/68 Details of reflectors forming part of the light source
• CPC Class Codes: F21K 9/90 Methods of manufacture
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2933/0025 relating to coatings
• CPC Class Codes: H01L 2933/0033 relating to semiconductor body packages
• CPC Class Codes: H01L 2933/0058 relating to optical field-shaping elements
• CPC Class Codes: H01L 33/005 Processes
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: Y10T 29/49988 Metal casting

Abstract

A metallic reflector manufacturing method for an LED package. The method includes preparing a metal plate, and processing a stamping reflector that includes a lower body and an upper body that is extended from an upper side of the lower body and is integrally formed with the lower body. A reflection surface that is slanted by a predetermined angle is formed at a central portion of the upper body and the lower body to reflect the light of the LED chip to the outside. A fixation portion is formed to fix the lower body on a substrate that the LED chip is mounted on. The method further includes sequentially plating Ni and Ag on the reflection surface or the stamping reflector surface. The stamping processing includes a piercing step, a drawing step, a first noting step, a half etching step that forms the fixation portion, and a second notching step.

Claims

1. A method of manufacturing a metallic reflector having a reflection surface formed to surround an LED chip that is disposed on a substrate at a predetermined height and having a predetermined slant angle to reflect the light of the LED chip to the outside, the method comprising:

(a) preparing a metal plate;

(b) processing, by stamping, a stamping reflector that includes

a lower body and an upper body that is extended from an upper side of the lower body and is integrally formed with the lower body,

a reflection surface that is slanted by a predetermined angle formed at a central portion of the upper body and the lower body to reflect the light of the LED chip to the outside, and

a fixation portion to fix the lower body on the substrate that the LED chip is mounted on; and

(c) sequentially plating Ni and Ag on the reflection surface or the stamping reflector surface;

wherein the stamping processing of step (b), comprises;

(b-1) piercing a base hole for each stage of the stamping process at an upper and lower edge of the metal plate in a length direction of the metal plate;

(b-2) draw forming the reflection surface on the metal plate between the base holes;

(b-3) eliminating scrap from the metal plate by a first notching step;

(b-4) forming the fixation portion by a half etching step;

(b-5) forming an opening by a second notching step, wherein the opening is a through hole defined by and surrounded by the lower body, such that the LED chip and the substrate are exposed to the outside through the opening while the lower body is disposed on the substrate on which the LED chip is disposed,

wherein the method further comprises;

forming, by a bending step, a catching portion, which fixes the stamping reflector on the substrate, during the stamping process; and

eliminating, by a cutting step, unnecessary parts from the stamping reflector, after step (b-5),

wherein a step portion is formed outside the lower body and the upper body to distinguish the lower body and the upper body in step (b-2),

wherein the metal plate includes a Cu plate, and

wherein the catching portion is formed to include a hook part which protrudes towards an inner side of the stamping reflector.