Wire splicing device, wire splicing method, and method for manufacturing splice structure

• US 10,014,671 B2
• Filed: 01/06/2017
• Issued: 07/03/2018
• Est. Priority Date: 05/28/2013
• Status: Active Grant

• Current Assignee: Fujikura Limited
• Original Assignee: Fujikura Limited
• Inventors: Fujita, Shinji
• Primary Examiner(s): Stoner, Kiley
• Application Number:
  US15/399,995
• Publication Number:
  US 20170117689A1
• Time in Patent Office: 543 Days
• Field of Search: 2281805, 228904, 228 45, 228245-262, 228 491, 228 494, 228 443, 228 447
• CPC Class Codes: B23K 1/0008 specially adapted for particular articles or work
• CPC Class Codes: B23K 1/0016 Brazing of electronic components
• CPC Class Codes: B23K 1/19 taking account of the properties of the materials to be soldered
• CPC Class Codes: B23K 20/004 Wire welding
• CPC Class Codes: B23K 2101/32 Wires
• CPC Class Codes: B23K 3/04 Heating appliances soldering lamps or blowpipes F23D; electric heating in general H05B
• CPC Class Codes: B23K 3/085 Cooling, heat sink or heat shielding means
• CPC Class Codes: B23K 3/087 Soldering or brazing jigs, fixtures or clamping means
• CPC Class Codes: B23K 37/0408 for planar work
• CPC Class Codes: H01B 12/00 Superconductive or hyperconductive conductors, cables, or transmission lines
• CPC Class Codes: H01B 12/04 Single wire
• CPC Class Codes: H01R 4/022 comprising preapplied solder
• CPC Class Codes: H01R 4/027 comprising means for positioning or holding the parts to be soldered or welded
• CPC Class Codes: H01R 4/68 Connections to or between superconductive connectors
• CPC Class Codes: H01R 43/02 for soldered or welded connections
• CPC Class Codes: H01R 43/0263 for positioning or holding parts during soldering or welding process
• CPC Class Codes: H02G 1/005 for cutting cables or wires, or splicing

Abstract

A wire splicing method including: disposing a tape-like first wire and a tape-like second wire in a holding base so that an end portion of the first wire and an end portion of the second wire face each other; disposing solder to straddle the first wire and the second wire; disposing a connection wire on the solder; pressing a heating body to the first wire, the second wire, and the connection wire via a pressing plate, and pressing together and heating the first wire, the second wire, and the connection wire so as to melt the solder; keeping the first wire, the second wire, and the connection wire pressed together by the pressing plate; separating the heating body from the pressing plate; and cooling the pressing plate to solidify the solder, and thereby connecting the first wire and the second wire together.

Claims

1. A wire splicing method comprising:

disposing a tape-like first wire and a tape-like second wire in a holding base so that an end portion of the first wire and an end portion of the second wire face each other;

disposing solder to straddle the first wire and the second wire;

disposing a connection wire on the solder;

pressing a heating body to the first wire, the second wire, and the connection wire via a pressing plate, and pressing together and heating the first wire, the second wire, and the connection wire so as to melt the solder;

keeping the first wire, the second wire, and the connection wire pressed together by the pressing plate;

separating the heating body from the pressing plate; and

cooling the pressing plate to solidify the solder, and thereby connecting the first wire and the second wire together.

2. The wire splicing method according to claim 1, wherein

the first wire, the second wire, and the connection wire are superconducting wires.

5. The wire connection method according to claim 1, wherein

the first wire and the second wire are superconducting wires.

3. A method for manufacturing a splice structure comprising:

disposing a tape-like first wire and a tape-like second wire in a holding base so that an end portion of the first wire and an end portion of the second wire face each other;

disposing solder to straddle the first wire and the second wire;

disposing a connection wire on the solder;

pressing a heating body to the first wire, the second wire, and the connection wire via a pressing plate, and pressing together and heating the first wire, the second wire, and the connection wire so as to melt the solder;

keeping the first wire, the second wire, and the connection wire pressed together by the pressing plate,

separating the heating body from the pressing plate; and

cooling the pressing plate to solidify the solder, and thereby connecting the first wire and the second wire together.

4. The method for manufacturing a splice structure according to claim 3, wherein the first wire, the second wire, and the connection wire are superconducting wires.

6. The method for manufacturing a connection structure according to claim 3, wherein the first wire and the second wire are superconducting wires.