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Multilayer electronic structures with embedded filters

  • US 10,014,843 B2
  • Filed: 08/08/2013
  • Issued: 07/03/2018
  • Est. Priority Date: 08/08/2013
  • Status: Active Grant
First Claim
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1. A composite electronic structure for coupling an IC Chip to a substrate, the composite electronic structure comprising:

  • at least one metal feature layer and at least one adjacent metal via layer, said layers embedded in a dielectric comprising a polymer matrix and extending in an X-Y plane and having height z,wherein the composite electronic structure further comprises;

    at least one capacitor coupled with at least one inductor, the at least one capacitor comprising;

    a selected feature layer forming a lower electrode; and

    a ceramic dielectric layer, the at least one capacitor disposed at a base of a via post in one of said at least one via layers such that the ceramic dielectric layer is sandwiched between the selected feature layer and the via post, such that the via post stands on the ceramic dielectric layer, and forms an upper electrode,andwherein the at least one inductor is formed in at least one of the at least one feature layer and the adjacent via layer.

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