Multilayer electronic structures with embedded filters
First Claim
1. A composite electronic structure for coupling an IC Chip to a substrate, the composite electronic structure comprising:
- at least one metal feature layer and at least one adjacent metal via layer, said layers embedded in a dielectric comprising a polymer matrix and extending in an X-Y plane and having height z,wherein the composite electronic structure further comprises;
at least one capacitor coupled with at least one inductor, the at least one capacitor comprising;
a selected feature layer forming a lower electrode; and
a ceramic dielectric layer, the at least one capacitor disposed at a base of a via post in one of said at least one via layers such that the ceramic dielectric layer is sandwiched between the selected feature layer and the via post, such that the via post stands on the ceramic dielectric layer, and forms an upper electrode,andwherein the at least one inductor is formed in at least one of the at least one feature layer and the adjacent via layer.
2 Assignments
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Accused Products
Abstract
A composite electronic structure comprising at least one feature layer and at least one adjacent via layer, said layers extending in an X-Y plane and having height z, wherein the structure comprises at least one capacitor coupled in series or parallel to at least one inductor to provide at least one filter;
the at least one capacitor being sandwiched between the at least one feature layer and at least one via in said at least adjacent via layer, such that the at least one via stands on the at least one capacitor, and the at least one of the first feature layer and the adjacent via layer includes at least one inductor extending in the XY plane.
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Citations
24 Claims
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1. A composite electronic structure for coupling an IC Chip to a substrate, the composite electronic structure comprising:
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at least one metal feature layer and at least one adjacent metal via layer, said layers embedded in a dielectric comprising a polymer matrix and extending in an X-Y plane and having height z, wherein the composite electronic structure further comprises; at least one capacitor coupled with at least one inductor, the at least one capacitor comprising; a selected feature layer forming a lower electrode; and a ceramic dielectric layer, the at least one capacitor disposed at a base of a via post in one of said at least one via layers such that the ceramic dielectric layer is sandwiched between the selected feature layer and the via post, such that the via post stands on the ceramic dielectric layer, and forms an upper electrode, and wherein the at least one inductor is formed in at least one of the at least one feature layer and the adjacent via layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23)
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24. A method of fabricating filters in an array, comprising fabricating capacitors by depositing a first electrode and a layer of ceramic and applying a via post over part of the layer of ceramic such that size of footprint of the via post on the layer of ceramic defines controls capacitance of the capacitor, and
fabricating inductors by electroplating copper into a pattern of photoresist, stripping away the photoresist and laminating.
Specification