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Circuit substrate and method for manufacturing circuit substrate

  • US 10,020,277 B2
  • Filed: 01/31/2017
  • Issued: 07/10/2018
  • Est. Priority Date: 02/03/2016
  • Status: Active Grant
First Claim
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1. A method for manufacturing a circuit substrate including a capacitor layer which includes a first metal layer, a dielectric layer which is provided on the first metal layer, and a second metal layer that is provided on the dielectric layer, in which the first metal layer includes a first electrode region which is provided on a base material and is exposed from the dielectric layer and to which a first terminal of a capacitor element for supplying current to a circuit part through the capacitor layer is connected, and the second metal layer includes a second electrode region in which the second metal layer is exposed and to which a second terminal of the capacitor element is connected, the method comprising:

  • forming the dielectric layer on a first base material;

    forming the first metal layer on the dielectric layer;

    placing the first base material, the formed dielectric layer, and the formed first metal layer on a second base material such that the first metal layer is positioned closer than the dielectric layer to the second base material;

    removing all the first base material from the dielectric layer; and

    forming the second metal layer on the dielectric layer after removing all the first base material from the dielectric layer.

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