Electronic module assembly having low loop inductance

• US 10,021,802 B2
• Filed: 09/19/2016
• Issued: 07/10/2018
• Est. Priority Date: 09/19/2016
• Status: Active Grant

• Current Assignee: General Electric Company
• Original Assignee: General Electric Company
• Inventors: Schuetz, Tobias, Cioffi, Philip Michael
• Primary Examiner(s): Bui, Hung S
• Application Number:
  US15/268,653
• Publication Number:
  US 20180084661A1
• Time in Patent Office: 659 Days
• Field of Search: 361729
• CPC Class Codes: H01L 23/485 consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts H01L23/4821, H01L23/4822, H01L23/4824, H01L23/4825 take precedence; materials H01L23/532, bond pads H01L24/02, bump connectors H01L24/10
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 25/071 the devices being arranged next and on each other, i.e. mixed assemblies
• CPC Class Codes: H01L 25/072 the devices being arranged next to each other
• CPC Class Codes: H02B 1/205 for connecting electrical apparatus mounted side by side on a rail
• CPC Class Codes: H02M 7/003 Constructional details, e.g. physical layout, assembly, wiring or busbar connections
• CPC Class Codes: H05K 7/026 Multiple connections subassemblies
• CPC Class Codes: H05K 7/1432 specially adapted for power drive units or power converters
• CPC Class Codes: H05K 7/14329 specially adapted for the configuration of power bus bars

Abstract

An electronic module is presented. The electronic module includes one or more electronic devices and a first bus electrically coupled to at least one of the one or more electronic devices. The first bus includes a first electrically conductive plate, a second electrically conductive plate, and a first electrically insulating plate disposed between the first electrically conductive plate and the second electrically conductive plate, where in a first portion of the first bus, the first electrically insulating plate is disposed such that the first electrically insulating plate is not in direct physical contact with at least one of the first electrically conductive plate and the second electrically conductive plate to form at least one cavity between the first electrically insulating plate and at least one of the first electrically conductive plate and the second electrically conductive plate. An electronic module assembly having low loop inductance is also presented.

Claims

1. An electronic module, comprising:

one or more electronic devices;

a first bus electrically coupled to at least one of the one or more electronic devices, wherein the first bus comprises;

a first electrically conductive plate;

a second electrically conductive plate; and

a first electrically insulating plate disposed between the first electrically conductive plate and the second electrically conductive plate,

wherein, in a first portion of the first bus, the first electrically insulating plate is disposed such that the first electrically insulating plate is not in direct physical contact with at least one of the first electrically conductive plate and the second electrically conductive plate to form at least one cavity between the first electrically insulating plate and at least one of the first electrically conductive plate and the second electrically conductive plate, and

wherein the first portion of the first bus is configured to be couplable to a second bus associated with a second electronic module such that a portion of the second bus is disposed in the at least one cavity.

2. The electronic module of claim 1, wherein the second bus comprises:

a third electrically conductive plate;

a fourth electrically conductive plate; and

a second electrically insulating plate disposed between the third electrically conductive plate and the fourth electrically conductive plate.

3. The electronic module of claim 1, wherein, in a second portion of the first bus, the first electrically insulating plate is disposed in direct physical contact with at least one of the first electrically conductive plate and the second electrically conductive plate.

4. The electronic module of claim 1, wherein, in a second portion of the first bus, the first electrically insulating plate is disposed such that the first electrically insulating plate is not in direct physical contact with the first electrically conductive plate and the second electrically conductive plate.

5. The electronic module of claim 1, wherein the electronic module is a semiconductor switching unit, a power supply unit, or a combination thereof.

6. The electronic module of claim 1, wherein the first electrically conductive plate is maintained at a first potential and the second electrically conductive plate is maintained at a second potential, and wherein the second potential is different from the first potential.

7. The electronic module of claim 1, wherein, in the first portion of the first bus, a length of the first electrically insulating plate is lesser than or equal to a length of at least one of the first electrically conductive plate and the second electrically conductive plate.

8. The electronic module of claim 1, wherein, in the first portion of the first bus, a terminal section of one or both of the first electrically conductive plate and the second electrically conductive plate are rolled.

9. The electronic module of claim 1, further comprising a housing configured to enclose the one or more electronic devices and at least a portion of the first bus.

10. The electronic module of claim 9, further comprising a mounting apparatus configured to exert a pressure on the first portion of the first bus.

11. The electronic module of claim 10, wherein the mounting apparatus is operatively coupled to the housing via an adhesive, one or more fasteners, or a combination thereof.

12. The electronic module of claim 10, wherein the mounting apparatus comprises one or more flexible protrusions extending toward the first bus and configured to exert the pressure on the first portion of the first bus.

13. The electronic module of claim 10, wherein the mounting apparatus further comprises at least one elastic member, and wherein the elastic member is configured to exert the pressure on the first portion of the first bus.

14. An electronic module assembly, comprising:

a first electronic module comprising;

one or more first electronic devices;

a first bus electrically coupled to at least one of the one or more first electronic devices, wherein the first bus comprises a first electrically conductive plate, a second electrically conductive plate, and a first electrically insulating plate disposed between the first electrically conductive plate and the second electrically conductive plate,

wherein in a first portion of the first bus, the first electrically insulating plate is disposed such that the first electrically insulating plate is not in direct physical contact with at least one of the first electrically conductive plate and the second electrically conductive plate to form at least one cavity between the first electrically insulating plate and at least one of the first electrically conductive plate and the second electrically conductive plate;

a second electronic module comprising;

one or more second electronic devices; and

a second bus electrically coupled to at least one of the one or more second electronic devices and comprising a third electrically conductive plate, a fourth electrically conductive plate, and a second electrically insulating plate disposed between the third electrically conductive plate and the fourth electrically conductive plate,

wherein the first electronic module is electrically coupled to the second electronic module such that a portion of the second bus is disposed in the at least one cavity in the first portion of the first bus.

15. The electronic module assembly of claim 14, wherein the first electronic module is a power supply unit and the second electronic module comprises one or more semiconductor switches.

16. The electronic module assembly of claim 15, wherein the one or more semiconductor switches comprise a gallium nitride based switch, a silicon carbide based switch, a gallium arsenide based switch, or combinations thereof.

17. The electronic module assembly of claim 14, wherein the portion of the second bus is disposed in the at least one cavity such that:

the first electrically insulating plate physically overlaps the second electrically insulating plate;

the first electrically conductive plate is electrically coupled to the third electrically conductive plate; and

the second electrically conductive plate is electrically coupled to the fourth electrically conductive plate.

18. The electronic module assembly of claim 14, further comprising a mounting apparatus disposed on at least one of the first electronic module and the second electronic module and configured to exert a pressure on the first portion of the first bus.

19. The electronic module assembly of claim 18, wherein the mounting apparatus comprises one or more flexible protrusions extending toward the first portion of the first bus and configured to exert the pressure on the first portion of the first bus.

20. A method for manufacturing an electronic module assembly, comprising:

providing a first electronic module, wherein the first electronic module comprises;

one or more electronic devices;

a first bus electrically coupled to at least one of the one or more electronic devices, wherein forming the first bus comprises;

a first electrically conductive plate;

a second electrically conductive plate;

a first electrically insulating plate disposed between the first electrically conductive plate and the second electrically conductive plate,

wherein in a first portion of the first bus, the first electrically insulating plate is disposed such that the first electrically insulating plate is not in direct physical contact with at least one of the first electrically conductive plate and the second electrically conductive plate to form at least one cavity between the first electrically insulating plate and at least one of the first electrically conductive plate and the second electrically conductive plate;

providing a second electronic module, wherein the second electronic module comprises;

one or more second electronic devices;

a second bus electrically coupled to at least one of the one or more second electronic devices and comprising a third electrically conductive plate, a fourth electrically conductive plate, and a second electrically insulating plate disposed between the third electrically conductive plate and the fourth electrically conductive plate; and

operatively coupling the first electronic module with the second electronic module such that a portion of the second bus is disposed in the at least one cavity in the first portion of the first bus to form the electronic module assembly.