Mass transfer tool manipulator assembly

• US 10,022,859 B2
• Filed: 02/26/2016
• Issued: 07/17/2018
• Est. Priority Date: 02/25/2013
• Status: Active Grant

• Current Assignee: Apple Inc.
• Original Assignee: Apple Inc.
• Inventors: Golda, Dariusz, Higginson, John A., Bibl, Andreas, Parks, Paul Argus, Bathurst, Stephen Paul
• Primary Examiner(s): ARBES, CARL J
• Application Number:
  US15/054,977
• Publication Number:
  US 20160176045A1
• Time in Patent Office: 872 Days
• CPC Class Codes: B25J 15/0052 multiple gripper units or multiple end effectors
• CPC Class Codes: B25J 15/0085 with means for applying an electrostatic force on the object to be gripped
• CPC Class Codes: B25J 17/0208 Compliance devices
• CPC Class Codes: B25J 7/00 Micromanipulators specimen supports for investigating or analysing materials G01N23/2204; associated with microscopes G02B21/32; means for supporting or positioning the objects or the material in discharge tubes H01J37/20
• CPC Class Codes: B25J 9/0015 Flexure members, i.e. parts of manipulators having a narrowed section allowing articulation by flexion
• CPC Class Codes: B25J 9/1015 using additional, e.g. microadjustment of the end effector
• CPC Class Codes: H01L 21/67144 Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
• CPC Class Codes: H01L 21/67721 the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames H01L21/6773 takes precedence
• CPC Class Codes: H01L 21/68 for positioning, orientation or alignment
• CPC Class Codes: H01L 21/6833 Details of electrostatic chucks
• CPC Class Codes: H01L 2224/75251 in the lower part of the bonding apparatus, e.g. in the apparatus chuck
• CPC Class Codes: H01L 2224/75252 in the upper part of the bonding apparatus, e.g. in the bonding head
• CPC Class Codes: H01L 2224/75282 in the upper part of the bonding apparatus, e.g. in the bonding head
• CPC Class Codes: H01L 2224/7565 Means for transporting the components to be connected
• CPC Class Codes: H01L 2224/75723 Electrostatic holding means
• CPC Class Codes: H01L 2224/75725 in the upper part of the bonding apparatus, e.g. in the bonding head
• CPC Class Codes: H01L 2224/75823 Pivoting mechanism
• CPC Class Codes: H01L 2224/759 Means for monitoring the connection process
• CPC Class Codes: H01L 2224/75901 using a computer, e.g. fully- or semi-automatic bonding
• CPC Class Codes: H01L 2224/7592 Load or pressure adjusting means, e.g. sensors
• CPC Class Codes: H01L 2224/7598 : specially adapted for batch processes
• CPC Class Codes: H01L 2224/75984 : of other portions
• CPC Class Codes: H01L 24/75 : Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 24/95 : at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/1461 : MEMS

Abstract

Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool manipulator assembly allows active alignment between an array of electrostatic transfer heads on a micro pick up array and an array of micro devices on a carrier substrate. Displacement of a compliant element of the mass transfer tool manipulator assembly may be sensed to control alignment between the array of electrostatic transfer heads and the array of micro devices.

Claims

1. A method comprising:

moving a mass transfer tool manipulator assembly toward a carrier substrate;

contacting an array of micro devices on the carrier substrate with an array of electrostatic transfer heads coupled with a pivot platform of the mass transfer tool manipulator assembly;

sensing deformation of a compliant element coupled with the pivot platform;

stopping relative movement between the mass transfer tool manipulator assembly and the carrier substrate;

applying a voltage to the array of electrostatic transfer heads to create a grip pressure on the array of micro devices; and

picking up the array of micro devices from the carrier substrate.

2. The method of claim 1, wherein sensing deformation comprises sensing strain in a displacement sensor integrated with the compliant element.

3. The method of claim 1, further comprising adjusting a position of a base coupled with the compliant element after sensing deformation and before stopping relative movement.

4. The method of claim 1, wherein adjusting the position comprises actuating an actuator assembly of the mass transfer tool manipulator assembly, the actuator assembly coupled to the base, to further align the base to a plane of the carrier substrate by tipping or tilting the base after sensing deformation.

5. The method of claim 1, further comprising applying heat to the array of electrostatic transfer heads while picking up the array of micro devices.

6. A method comprising:

moving a mass transfer tool manipulator assembly toward a receiving substrate;

contacting the receiving substrate with an array of micro devices carried by an array of electrostatic transfer heads coupled with a pivot platform of the mass transfer tool manipulator assembly;

sensing deformation of a compliant element coupled with the pivot platform;

stopping relative movement between the mass transfer tool manipulator assembly and the receiving substrate;

removing a voltage from the array of electrostatic transfer heads; and

releasing the array of micro devices onto the receiving substrate.

7. The method of claim 6, wherein sensing deformation comprises sensing strain in a displacement sensor integrated with the compliant element.

8. The method of claim 6, further comprising adjusting a position of a base coupled with the compliant element after sensing deformation and before stopping relative movement.

9. The method of claim 8, wherein adjusting the position comprises actuating an actuator assembly of the mass transfer tool manipulator assembly, the actuator assembly coupled to the base, to further align the base to a plane of the receiving substrate by tipping or tilting the base after sensing deformation.

10. The method of claim 6, further comprising applying heat to the array of electrostatic transfer heads before removing the voltage.