Liquid ejection head, liquid ejection apparatus, and manufacturing method
First Claim
Patent Images
1. A liquid ejection head comprising:
- an element board which includes an ejection opening ejecting a liquid, an element provided corresponding to the ejection opening and generating energy used to eject the liquid from the ejection opening, and a pressure chamber having the element provided therein; and
a resin film which is provided at a rear face provided with the ejection opening in the element board and which includes a supply opening supplying the liquid to the pressure chamber,wherein a supply path for supplying the liquid supplied from the supply opening to the pressure chamber is formed between the rear face of the element board and the resin film, andwherein an outer shape of the resin film is partially smaller than an outer shape of the element board so as not to protrude from the outer shape of the element board.
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Abstract
A liquid ejection head capable of suppressing a change in pressure of a pressure chamber, a liquid ejection apparatus, and a manufacturing method are provided. For that reason, a lid member is formed on a wafer-shaped element board and the element board is cut into chips to manufacture a print element board.
27 Citations
22 Claims
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1. A liquid ejection head comprising:
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an element board which includes an ejection opening ejecting a liquid, an element provided corresponding to the ejection opening and generating energy used to eject the liquid from the ejection opening, and a pressure chamber having the element provided therein; and a resin film which is provided at a rear face provided with the ejection opening in the element board and which includes a supply opening supplying the liquid to the pressure chamber, wherein a supply path for supplying the liquid supplied from the supply opening to the pressure chamber is formed between the rear face of the element board and the resin film, and wherein an outer shape of the resin film is partially smaller than an outer shape of the element board so as not to protrude from the outer shape of the element board. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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18. A liquid ejection head ejecting a liquid, comprising:
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an element board which includes an ejection opening ejecting the liquid, an element provided corresponding to the ejection opening and generating energy used to eject the liquid from the ejection opening, and a pressure chamber having the element provided therein; and a resin film which is provided at a rear face of a face provided with the ejection opening in the element board and includes a supply opening supplying the liquid to the pressure chamber and a collection opening collecting the liquid from the pressure chamber, wherein the rear face of the element board is provided with a supply path supplying the liquid supplied from the supply opening to the pressure chamber and a collection path collecting the liquid collected from the pressure chamber to the collection opening, and wherein a part of the supply path and the collection path are formed by the resin film. - View Dependent Claims (19, 20, 21)
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22. A liquid ejection apparatus with a liquid ejection head including an element board which includes an ejection opening ejecting a liquid, an element provided corresponding to the ejection opening and generating energy used to eject the liquid from the ejection opening, and a pressure chamber having the element provided therein, and a resin film which is provided at a rear face of a face provided with the ejection opening in the element board and includes a supply opening supplying the liquid to the pressure chamber and a collection opening collecting the liquid from the pressure chamber,
wherein the rear face of the element board is provided with a supply path supplying the liquid supplied from the supply opening to the pressure chamber and a collection path collecting the liquid collected from the pressure chamber to the collection opening, and wherein a part of the supply path and the collection path are formed by the resin film.
Specification