Measuring device and method for ascertaining a pressure map

• US 10,024,741 B2
• Filed: 06/05/2013
• Issued: 07/17/2018
• Est. Priority Date: 06/05/2013
• Status: Active Grant

• Current Assignee: EV Group E Thallner GmbH (Thallner Privatstiftung)
• Original Assignee: EV Group E Thallner GmbH (Thallner Privatstiftung)
• Inventors: Povazay, Boris, Peic, Antun
• Primary Examiner(s): DUNLAP, JONATHAN M
• Application Number:
  US14/894,709
• Publication Number:
  US 20160103026A1
• Time in Patent Office: 1,868 Days
• Field of Search: 25022714, 345173, 345175, 356136, 356300, 356 32, 356432, 356445, 356485, 73800, 73818, 73862046, 73862624
• CPC Class Codes: G01L 1/24 by measuring variations of optical properties of material when it is stressed, e.g. by photoelastic stress analysis using infrared, visible light, ultraviolet
• CPC Class Codes: G01L 1/241 by photoelastic stress analysis
• CPC Class Codes: G01L 1/242 the material being an optical fibre
• CPC Class Codes: G01L 1/247 using distributed sensing elements, e.g. microcapsules along a single optical fibre G01L1/242
• CPC Class Codes: G01L 1/25 using wave or particle radiation, e.g. X-rays , microwaves, neutrons G01L1/24 takes precedence
• CPC Class Codes: G01L 11/02 by optical means
• CPC Class Codes: G01L 5/0047 measuring forces due to residual stresses
• CPC Class Codes: G01L 9/0076 using photoelectric means
• CPC Class Codes: G01N 2021/1787 Tomographic, i.e. computerised reconstruction from projective measurements
• CPC Class Codes: G01N 2223/419 computed tomograph
• CPC Class Codes: G01N 23/046 using tomography, e.g. computed tomography [CT]
• CPC Class Codes: G06F 2203/04109 FTIR in optical digitiser, i.e. touch detection by frustrating the total internal reflection within an optical waveguide due to changes of optical properties or deformation at the touch location
• CPC Class Codes: G06F 3/0325 using a plurality of light emitters or reflectors or a plurality of detectors forming a reference frame from which to derive the orientation of the object, e.g. by triangulation or on the basis of reference deformation in the picked up image
• CPC Class Codes: G06F 3/041 Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
• CPC Class Codes: G06F 3/042 by opto-electronic means
• CPC Class Codes: G06F 3/0421 by interrupting or reflecting a light beam, e.g. optical touch-screen
• CPC Class Codes: G06F 3/0423 using sweeping light beams, e.g. using rotating or vibrating mirror
• CPC Class Codes: G06F 3/0428 by sensing at the edges of the touch surface the interruption of optical paths, e.g. an illumination plane, parallel to the touch surface which may be virtual sensing beam interruptions in a planar beam grid of an optical touch-screen G06F3/0421
• CPC Class Codes: H01L 22/12 for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions electrical measurement of diffusions H01L22/14

Abstract

A measuring device for determining a pressure map during application of pressure to at least one measurement layer between a first pressure body and a second pressure body the measuring device comprising: (i) at least one transmitter located on one peripheral edge of the measurement layer for emission of signals in the form of electromagnetic waves along a first signal route which runs through the measurement layer and at least one other signal route which runs through the measurement layer, and (ii) at least one receiver located on the peripheral edge for reception of the signals of the first signal route and other signal route(s), which signals are sent by the transmitter through the measurement layer and can be changed when pressure is applied. Furthermore this invention relates to a corresponding method.

Claims

1. A measuring device for determining a pressure map before and/or during a bond process, the measuring device comprising:

a sensor comprising a first substrate, a second substrate, and a measurement layer by which the first substrate and the second substrate are permanently connected, the measurement layer being disposed between the first substrate and the second substrate, the measurement layer including an optical material having optical properties that are configured to change when exposed to pressure applied to the measurement layer, the sensor being disposed between a first pressure body and a second pressure body, the first pressure body being separated from the measurement layer by the first substrate, the second pressure body being separated from the measurement layer by the second substrate, the pressure bodies being configured to apply said pressure to the measurement layer,

a transmitter located on a peripheral edge of the measurement layer for emission of signals in the form of electromagnetic waves along a first signal route which runs through the measurement layer and at least one other signal route which runs through the measurement layer, the emitted signals being configured to change when exposed to changes in pressure applied by the pressure bodies to the measurement layer,

a receiver located on the peripheral edge of the measurement layer, the receiver being configured to receive the emitted signals of the first signal route and the at least one other signal route through the measurement layer and record the received signals, and

an evaluation unit configured to evaluate the received and recorded signals along the signal routes and form the pressure map by determining localized pressure values from the evaluated signals by reconstruction of the evaluated signals.

2. The measuring device as claimed in claim 1, wherein the measuring device is used in a wafer processing device.

3. The measuring device as claimed in claim 1, wherein the transmitter and/or the receiver are/is moved along the peripheral edge of the measurement layer.

4. The measuring device as claimed in claim 1, wherein the transmitter is one of a plurality of transmitters distributed on the peripheral edge of the measurement layer.

5. The measuring device as claimed in claim 4, wherein each of said transmitters emits several signal routes.

6. The measuring device as claimed in claim 1, wherein the receiver acquires optical properties of the signal.

7. The measuring device as claimed in claim 6, wherein the optical properties of the signal include one or more of the following properties:

double refraction, index of refraction, mode of signals shaped as transverse electromagnetic waves, transit time, and spectral coding.

8. The measuring device as claimed in claim 1, wherein the receiver is one of a plurality of receivers distributed on the peripheral edge of the measurement layer.

9. The measuring device as claimed in claim 8, wherein the transmitter is one of a plurality of transmitters distributed on the peripheral edge of the measurement layer, and

wherein said receivers are assigned to one of said transmitters at a time.

10. The measuring device as claimed in claim 8, wherein the transmitter is one of a plurality of transmitters distributed on the peripheral edge of the measurement layer, and

wherein two or more of said receivers are assigned to each of said transmitters.

11. The measuring device as claimed in claim 8, wherein each of said receivers is assigned to one single signal route at a time.

12. The measuring device as claimed in claim 11, wherein the transmitter is one of a plurality of transmitters distributed on the peripheral edge of the measurement layer, and

wherein each of said transmitters emits several signal routes.

13. The measuring device as claimed in claim 1, wherein said evaluation unit determines the localized pressure values by a transform for the reconstruction of the evaluated signals.

14. The measuring device as claimed in claim 13, wherein said transform is a Radon transform.

15. The measuring device as claimed in claim 1, wherein the first substrate is permanently cemented to the second substrate by the optical material.

16. The measuring device as claimed in claim 1, wherein the pressure is applied to the measurement layer only by the first pressure body and the second pressure body.

17. The measuring device as claimed in claim 1, wherein the measurement layer bonds the first substrate to the second substrate.

18. The measuring device as claimed in claim 1, wherein the sensor constitutes a wafer stack.

19. A method for determining a pressure map before and/or during a bond process, the method comprising:

arranging a sensor of a measuring device between a first pressure body and a second pressure body, the sensor comprising a first substrate, a second substrate, and a measurement layer by which the first substrate and the second substrate are permanently connected, the measurement layer being disposed between the first substrate and the second substrate, the measurement layer including an optical material having optical properties that are configured to change when exposed to pressure applied to the measurement layer,

applying said pressure to the measurement layer by the pressure bodies, the first pressure body being separated from the measurement layer by the first substrate, the second pressure body being separated from the measurement layer by the second substrate,

emitting, using a transmitter of the measuring device, signals in the form of electromagnetic waves along a first signal route running through the measurement layer and at least one other signal route which runs through the measurement layer such that the emitted signals are changed when exposed to changes in pressure applied by the pressure bodies to the measurement layer, the transmitter being located on a peripheral edge of the measurement layer,

receiving, using a receiver of the measuring device, the emitted signals of the first signal route and the at least one other signal route, the receiver being located on the peripheral edge of the measurement layer,

recording, using the receiver, said received signals,

evaluating, using an evaluation unit of the measuring device, the received and recorded signals along the signal routes, and

forming, using the evaluation unit, the pressure map by determining localized pressure values from the evaluated signals by reconstruction of the evaluated signals.

20. The method as claimed in claim 19, wherein the first substrate is permanently connected to the second substrate by the optical material.

21. A measuring device for determining a pressure map before and/or during a bond process, the measuring device comprising:

a measurement layer disposed between a first substrate and a second substrate, the measurement layer including an optical material permanently cementing the first substrate to the second substrate, the optical material having optical properties that are configured to change when exposed to pressure applied to the measurement layer, the sensor being disposed between a first pressure body and a second pressure body, the first pressure body being separated from the measurement layer by the first substrate, the second pressure body being separated from the measurement layer by the second substrate, the pressure bodies being configured to apply said pressure to the measurement layer,

a transmitter located on a peripheral edge of the measurement layer for emission of signals in the form of electromagnetic waves along a first signal route which runs through the measurement layer and at least one other signal route which runs through the measurement layer, the emitted signals being configured to change when exposed to changes in pressure applied by the pressure bodies to the measurement layer,

a receiver located on the peripheral edge of the measurement layer, the receiver being configured to receive the emitted signals of the first signal route and the at least one other signal route through the measurement layer and record the received signals, and

an evaluation unit configured to evaluate the received and recorded signals along the signal routes and form the pressure map by determining localized pressure values from the evaluated signals by reconstruction of the evaluated signals.