Surfaces having particles and related methods

• US 10,024,840 B2
• Filed: 10/18/2013
• Issued: 07/17/2018
• Est. Priority Date: 05/29/2007
• Status: Active Grant

• Current Assignee: TPK Holding Co., Ltd.
• Original Assignee: TPK Holding Co., Ltd.
• Inventors: Srinivas, Arjun Daniel, Peng, Calvin, Mittal, Alexander Chow, Agarwal, Priyanka
• Primary Examiner(s): Gulakowski, Randy P
• Assistant Examiner(s): Nguyen, Ha S
• Application Number:
  US14/057,993
• Publication Number:
  US 20140041905A1
• Time in Patent Office: 1,733 Days
• CPC Class Codes: A01N 2300/00 Combinations or mixtures of active ingredients covered by classes A01N27/00 - A01N65/48 with other active or formulation relevant ingredients, e.g. specific carrier materials or surfactants, covered by classes A01N25/00 - A01N65/48
• CPC Class Codes: A01N 25/08 containing solids as carriers or diluents
• CPC Class Codes: A01N 25/10 Macromolecular compounds
• CPC Class Codes: A01N 25/34 Shaped forms, e.g. sheets, not provided for in any other sub-group of this main group
• CPC Class Codes: A01N 59/16 Heavy metals; Compounds thereof
• CPC Class Codes: B05D 2401/32 applied as powders
• CPC Class Codes: B05D 2601/28 Metals
• CPC Class Codes: B05D 3/002 Pretreatement
• CPC Class Codes: B05D 3/10 by other chemical means
• CPC Class Codes: B05D 7/02 to macromolecular substances, e.g. rubber treatment or coating of shaped articles made of macromolecular substances C08J7/00
• CPC Class Codes: B29C 2059/023 Microembossing
• CPC Class Codes: B29C 2059/028 Incorporating particles by impact in the surface, e.g. using fluid jets or explosive forces to implant particles
• CPC Class Codes: B29C 59/022 characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
• CPC Class Codes: C08J 7/02 with solvents, e.g. swelling agents
• CPC Class Codes: C08J 7/0427 with only one layer of a composition containing a polymer binder with more layers C08J7/042
• CPC Class Codes: C08J 7/044 Forming conductive coatings; Forming coatings having anti-static properties
• CPC Class Codes: C08J 7/046 Forming abrasion-resistant coatings; Forming surface-hardening coatings
• CPC Class Codes: G01N 33/48 Biological material, e.g. blood, urine G01N33/02, G01N33/26, G01N33/44, G01N33/46 take precedence; Haemocytometers counting blood corpuscules distributed over a surface by scanning the surface G06M11/02
• CPC Class Codes: H01B 1/22 the conductive material comprising metals or alloys

Abstract

Provided are surfaces comprising particles, which particles may possess, for example, antimicrobial or biosensing properties. Also provided are related methods for fabrication of the inventive articles. Also provided are systems and methods for treating fluids, objects, and targets with the inventive surfaces.

Claims

1. A composite material, comprising:

a substrate having at least one surface in which a population of metallic nanowires is at least partially embedded,

the population of metallic nanowires forming a conductive pathway by touching or proximity of the metallic nanowires to one another, wherein the population of metallic nanowires provides a coverage of 1% to 5% of the surface of the substrate, and

wherein the substrate is a single-layer substrate, and wherein the substrate is capable of reaction with the population of metallic nanowires, and wherein the substrate degrades the population of metallic nanowires.

2. The composite material of claim 1, wherein the substrate comprises a polymer.

3. The composite material of claim 2, wherein the polymer is characterized as conductive.

4. The composite material of claim 1, wherein the population of metallic nanowires comprises silver.

5. The composite material of claim 1, wherein the substrate is harder than the population of metallic nanowires.

6. The composite material of claim 2, wherein at least one of the population of metallic nanowires is fully embedded below the surface of the substrate.

7. The composite material of claim 6, wherein at least another one of the population of metallic nanowires includes a first portion embedded below the surface of the substrate and a second portion exposed above the surface of the substrate.

8. The composite material of claim 2, wherein the population of metallic nanowires comprises metallic nanowires that are fused together.

9. The composite material of claim 2, wherein the population of metallic nanowires is localized in a surface portion of the substrate, such that a remaining portion of the substrate is devoid of any metallic nanowire.

10. The composite material of claim 2, wherein the substrate is a polymeric sheet.

11. A display device comprising the composite material of claim 2.

30. The composite material of claim 2, wherein the substrate is porous.

12. A composite material, comprising:

a substrate having at least one surface in which nanowires are at least partially embedded,

the embedded nanowires are localized in a surface portion of the substrate, such that a remaining portion of the substrate is devoid of any nanowire, wherein the embedded nanowires provides a coverage of 1% to 5% of the surface of the substrate,

the substrate, with the embedded nanowires, has a lower resistivity relative to the substrate in the absence of the embedded nanowires, and

wherein the substrate is a single-layer substrate, and wherein the substrate is capable of reaction with the embedded nanowires, and wherein the substrate degrades the embedded nanowires.

13. The composite material of claim 12, wherein the embedded nanowires comprise silver.

14. The composite material of claim 12, wherein at least one of the embedded nanowires is fully embedded below the surface of the substrate.

15. The composite material of claim 12, wherein at least one of the embedded nanowires includes a first portion embedded below the surface of the substrate and a second portion exposed above the surface of the substrate.

16. The composite material of claim 12, wherein the embedded nanowires comprise nanowires that are fused together.

17. The composite material of claim 12, wherein the embedded nanowires form a conductive pathway by touching or proximity of the embedded nanowires to one another.

18. The composite material of claim 12, wherein the substrate is an extruded polymeric substrate.

19. The composite material of claim 12, wherein the substrate is a polymeric sheet.

20. A sensor device comprising the composite material of claim 12.

31. The composite material of claim 12, wherein the substrate is porous.

21. A composite material, comprising:

a substrate having at least one surface in which a population of metallic particles is at least partially embedded,

the population of metallic particles forming a conductive pathway by touching or proximity of the metallic particles to one another, wherein the population of metallic particles provides a coverage of 1% to 5% of the surface of the substrate, and

wherein the substrate is a single-layer substrate, and wherein the substrate is capable of reaction with the population of metallic particles, wherein the substrate degrades the population of metallic particles.

22. The composite material of claim 21, wherein the population of metallic particles comprises nanowires, nanorods, or a combination thereof.

23. The composite material of claim 21, wherein the population of metallic particles comprises metallic particles of disproportionate aspect ratio.

24. The composite material of claim 21, wherein the population of metallic particles comprises silver-containing particles.

25. The composite material of claim 21, wherein at least one of the population of metallic particles is fully embedded below the surface of the substrate.

26. The composite material of claim 21, wherein at least one of the population of metallic particles is partially exposed above the surface of the substrate.

27. The composite material of claim 21, wherein the population of metallic particles comprises metallic particles that are fused together.

28. The composite material of claim 21, wherein the substrate is a polymeric sheet.

29. A display device comprising the composite material of claim 21.

32. The composite material of claim 21, wherein the substrate is porous.