Wireless communication device and wireless communication module manufacturing method
First Claim
1. A wireless communication device comprising:
- a wireless communication module including a wireless IC chip including first and second input/output terminals and processing an RF signal of a UHF band, and an impedance matching circuit connected to the first and the second input/output terminals; and
an antenna base material having the wireless communication module mounted thereon and including an antenna element disposed thereon;
whereinthe impedance matching circuit includes;
a first multi-layer coil electric conductor including one end connected to the first input/output terminal and including a plurality of loop electric conductors provided in a plurality of layers; and
a second multi-layer coil electric conductor including one end connected to another end of the first multi-layer coil electric conductor and another end connected to the second input/output terminal and including a plurality of loop electric conductors provided in a plurality of layers;
whereina surface of the wireless communication module includes a first terminal electrode disposed thereon that is connected to any one of the plurality of loop electric conductors of the first multi-layer coil electric conductor through a first in-plane electric conductor and a first interlayer electric conductor, and a second terminal electrode disposed thereon that is connected to any one of the plurality of loop electric conductors of the second multi-layer coil electric conductor through a second in-plane electric conductor and a second interlayer electric conductor; and
an impedance of the antenna element for the first and the second input/output terminals of the wireless IC chip is determined by a connection position of the first in-plane electric conductor to the first multi-layer coil electric conductor and a connection position of the second in-plane electric conductor to the second multi-layer coil electric conductor.
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Accused Products
Abstract
In a wireless communication device, an impedance matching circuit includes a first layered coil conductor one end of which is connected to a first I/O terminal, the first layered coil conductor includes loop conductors including a plurality of layers, and a second layered coil conductor one end of which is connected to the other end of the first layered coil conductor and the other end of which is respectively connected to a second I/O terminal, the second layered coil conductor includes loop conductors including a plurality of layers. On the surface of the wireless communication device, first and second terminal electrodes are connected via first and second in-plane conductors and first and second inter-layer conductors to any of the loop conductors of the first and second layered coil conductors. Connection locations of the first and second in-plane conductors to the first and second layered conductors determine the antenna element-side impedance seen by the first and second I/O terminals of the wireless IC chip.
7 Citations
5 Claims
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1. A wireless communication device comprising:
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a wireless communication module including a wireless IC chip including first and second input/output terminals and processing an RF signal of a UHF band, and an impedance matching circuit connected to the first and the second input/output terminals; and an antenna base material having the wireless communication module mounted thereon and including an antenna element disposed thereon;
whereinthe impedance matching circuit includes; a first multi-layer coil electric conductor including one end connected to the first input/output terminal and including a plurality of loop electric conductors provided in a plurality of layers; and a second multi-layer coil electric conductor including one end connected to another end of the first multi-layer coil electric conductor and another end connected to the second input/output terminal and including a plurality of loop electric conductors provided in a plurality of layers;
whereina surface of the wireless communication module includes a first terminal electrode disposed thereon that is connected to any one of the plurality of loop electric conductors of the first multi-layer coil electric conductor through a first in-plane electric conductor and a first interlayer electric conductor, and a second terminal electrode disposed thereon that is connected to any one of the plurality of loop electric conductors of the second multi-layer coil electric conductor through a second in-plane electric conductor and a second interlayer electric conductor; and an impedance of the antenna element for the first and the second input/output terminals of the wireless IC chip is determined by a connection position of the first in-plane electric conductor to the first multi-layer coil electric conductor and a connection position of the second in-plane electric conductor to the second multi-layer coil electric conductor. - View Dependent Claims (2, 3, 4, 5)
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Specification