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Wireless communication device and wireless communication module manufacturing method

  • US 10,026,036 B2
  • Filed: 07/18/2016
  • Issued: 07/17/2018
  • Est. Priority Date: 01/30/2014
  • Status: Active Grant
First Claim
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1. A wireless communication device comprising:

  • a wireless communication module including a wireless IC chip including first and second input/output terminals and processing an RF signal of a UHF band, and an impedance matching circuit connected to the first and the second input/output terminals; and

    an antenna base material having the wireless communication module mounted thereon and including an antenna element disposed thereon;

    whereinthe impedance matching circuit includes;

    a first multi-layer coil electric conductor including one end connected to the first input/output terminal and including a plurality of loop electric conductors provided in a plurality of layers; and

    a second multi-layer coil electric conductor including one end connected to another end of the first multi-layer coil electric conductor and another end connected to the second input/output terminal and including a plurality of loop electric conductors provided in a plurality of layers;

    whereina surface of the wireless communication module includes a first terminal electrode disposed thereon that is connected to any one of the plurality of loop electric conductors of the first multi-layer coil electric conductor through a first in-plane electric conductor and a first interlayer electric conductor, and a second terminal electrode disposed thereon that is connected to any one of the plurality of loop electric conductors of the second multi-layer coil electric conductor through a second in-plane electric conductor and a second interlayer electric conductor; and

    an impedance of the antenna element for the first and the second input/output terminals of the wireless IC chip is determined by a connection position of the first in-plane electric conductor to the first multi-layer coil electric conductor and a connection position of the second in-plane electric conductor to the second multi-layer coil electric conductor.

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