Method of manufacturing an electronic component

• US 10,026,549 B2
• Filed: 11/17/2014
• Issued: 07/17/2018
• Est. Priority Date: 12/27/2013
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: Kawachi, Takao, Sato, Yoshiharu, Ogawa, Takahiro, Ida, Isao
• Primary Examiner(s): Kim, Paul D
• Application Number:
  US15/107,728
• Publication Number:
  US 20160322160A1
• Time in Patent Office: 1,338 Days
• CPC Class Codes: H01F 2017/048 with encapsulating core, e.g. made of resin and magnetic powder
• CPC Class Codes: H01F 27/2871 Pancake coils
• CPC Class Codes: H01F 27/292 Surface mounted devices
• CPC Class Codes: H01F 27/306 Fastening or mounting coils or windings on core, casing or other support
• CPC Class Codes: H01F 41/04 for manufacturing coils coils for transformer or inductances H01F27/28

Abstract

A method of manufacturing an electronic component includes: a coil forming step of forming a winding coil by a wire-shaped conductor; a press fitting step of embedding the winding coil into a plate-shaped composite magnetic material in a state in which the plate-shaped composite magnetic material is softened, the plate-shaped composite magnetic material being a composite magnetic material that is formed in a plate shape and in which magnetic particles and a resin are mixed; a covering step of covering a part of the winding coil with another plate-shaped composite magnetic material that is softened, the part of the coil being a part remaining uncovered in the press fitting step; a pressurizing step of pressurizing and molding an entirety; and, a hardening step of hardening the composite magnetic material.

Claims

1. A method of manufacturing an electronic component, the method comprising:

a coil forming step of forming a coil by a wire-shaped conductor;

a press fitting step of embedding the coil into a plate-shaped composite magnetic material in a state in which the plate-shaped composite magnetic material is softened, the plate-shaped composite magnetic material being a first composite magnetic material that is formed in a plate shape and in which magnetic particles and a resin are mixed, each of upper and bottom ends of the coil being partially exposed;

a covering step of disposing second and third plate-shaped composite magnetic materials which are soften on top and bottom of the soften first composite magnetic material, respectively, so as to cover a part of the coil with the second and third plate-shaped composite magnetic materials, the part of the coil being a part remaining uncovered on each of the upper and bottom ends of the coil in the press fitting step;

a pressurizing step of pressurizing and molding an entirety; and

a hardening step of hardening the composite magnetic material.

2. The method of manufacturing an electronic component according to claim 1, wherein

at least the press fitting step and the steps following the press fitting step are performed to more than one coil at the same time using the plate-shaped composite magnetic material having a size on which a plurality of coils are placeable.

3. The method of manufacturing an electronic component according to claim 1, wherein

the pressurizing step and the hardening step are performed at the same time.