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Method of manufacturing an electronic component

  • US 10,026,549 B2
  • Filed: 11/17/2014
  • Issued: 07/17/2018
  • Est. Priority Date: 12/27/2013
  • Status: Active Grant
First Claim
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1. A method of manufacturing an electronic component, the method comprising:

  • a coil forming step of forming a coil by a wire-shaped conductor;

    a press fitting step of embedding the coil into a plate-shaped composite magnetic material in a state in which the plate-shaped composite magnetic material is softened, the plate-shaped composite magnetic material being a first composite magnetic material that is formed in a plate shape and in which magnetic particles and a resin are mixed, each of upper and bottom ends of the coil being partially exposed;

    a covering step of disposing second and third plate-shaped composite magnetic materials which are soften on top and bottom of the soften first composite magnetic material, respectively, so as to cover a part of the coil with the second and third plate-shaped composite magnetic materials, the part of the coil being a part remaining uncovered on each of the upper and bottom ends of the coil in the press fitting step;

    a pressurizing step of pressurizing and molding an entirety; and

    a hardening step of hardening the composite magnetic material.

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