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Chip capacitor, circuit assembly, and electronic device

  • US 10,026,557 B2
  • Filed: 05/16/2017
  • Issued: 07/17/2018
  • Est. Priority Date: 11/02/2012
  • Status: Active Grant
First Claim
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1. A chip capacitor comprising:

  • a substrate having a plurality of trenches;

    a first external electrode and a second external electrode formed on or over the substrate;

    a capacitor element connected between the first external electrode and the second external electrode; and

    a diode connected between the first external electrode and the second external electrode, and in parallel to the capacitor element,wherein the capacitor element includesa lower electrode that is formed on or over an inner surface of the plurality of trenches or inside the inner surface of the plurality of trenches,a capacitance film that is laminated on or over the lower electrode such that the capacitance film is formed along the inner surface of the plurality of trenches, andan upper electrode that is embedded in the plurality of trenches via the capacitance film such that the upper electrode straddles the plurality of trenches and collectively covers the plurality of trenches,wherein the capacitor element includes a plurality of capacitor components, andthe chip capacitor further includes a plurality of fuses provided on the substrate and disconnectably connecting each of the plurality of the capacitor components to the first external electrode and the second external electrode.

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