Plasma distribution control
First Claim
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1. A system configured to perform plasma related fabrication processes, the system comprising:
- a chamber;
a wafer stage positioned within the chamber, the wafer stage being configured to secure a process wafer;
a bottom electrode positioned beneath the wafer stage;
a top electrode positioned external to the chamber; and
a plasma distribution mechanism, the plasma distribution mechanism being reconfigurable to allow for more than one plasma distribution profile.
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Abstract
A system is configured to perform plasma related fabrication processes. The system includes a process chamber and a wafer stage positioned within the process chamber. The wafer stage is configured to secure a process wafer. The system further includes a bottom electrode positioned beneath the wafer stage, a top electrode positioned external to the chamber, and a plasma distribution mechanism. The plasma distribution mechanism is reconfigurable to allow for more than one plasma distribution profile.
5 Citations
20 Claims
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1. A system configured to perform plasma related fabrication processes, the system comprising:
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a chamber; a wafer stage positioned within the chamber, the wafer stage being configured to secure a process wafer; a bottom electrode positioned beneath the wafer stage; a top electrode positioned external to the chamber; and a plasma distribution mechanism, the plasma distribution mechanism being reconfigurable to allow for more than one plasma distribution profile. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A system comprising:
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a fabrication tool comprising; a wafer stage positioned within a fabrication chamber; and a plasma distribution mechanism; and a control system comprising; a processor; and a memory with machine readable instructions that when executed by the processor, cause the system to select one of a plurality of configurations for the plasma distribution mechanism, each of the configurations being designed to produce a different plasma distribution profile. - View Dependent Claims (16, 17)
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18. A method comprising:
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determine a desired result of a plasma-related fabrication process; selecting one of a plurality of configurations for a plasma distribution mechanism of a fabrication tool for the plasma-related fabrication process based on the desired result, the plasma distribution mechanism being reconfigurable to provide for more than one plasma distribution profile; reconfiguring the plasma distribution mechanism based on the one of the plurality of configurations; securing a process wafer to a wafer stage within the fabrication tool; and performing the plasma-related fabrication process on the process wafer, the plasma-related fabrication process having a plasma distribution profile based on the one of the plurality of configurations. - View Dependent Claims (19, 20)
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Specification