Low-stress low-hydrogen LPCVD silicon nitride
First Claim
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1. A Gallium-Nitride Field Effect Transistor (GaN FET) device, comprising:
- a stack of gallium nitride and aluminum gallium nitride layers as a substrate;
a cap layer of gallium nitride on the stack;
a silicon nitride layer on a first surface of the cap layer, the silicon nitride layer having the following properties;
a silicon;
nitrogen atomic ratio within 2 percent of the ratio 3;
4;
a stress of 600 megapascals (MPa) to 1000 MPa; and
a hydrogen content of less than 5 atomic percent; and
a gate of the GaN FET over the cap layer, wherein the gate is in direct contact with the first surface of the cap layer at a center portion of the gate and partially overlaps the silicon nitride layer at end portions of the gate.
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Abstract
A microelectronic device contains a high performance silicon nitride layer which is stoichiometric within 2 atomic percent, has a low stress of 600 MPa to 1000 MPa, and has a low hydrogen content, less than 5 atomic percent, formed by an LPCVD process. The LPCVD process uses ammonia and dichlorosilane gases in a ratio of 4 to 6, at a pressure of 150 millitorr to 250 millitorr, and at a temperature of 800° C. to 820° C.
24 Citations
13 Claims
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1. A Gallium-Nitride Field Effect Transistor (GaN FET) device, comprising:
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a stack of gallium nitride and aluminum gallium nitride layers as a substrate; a cap layer of gallium nitride on the stack; a silicon nitride layer on a first surface of the cap layer, the silicon nitride layer having the following properties; a silicon;
nitrogen atomic ratio within 2 percent of the ratio 3;
4;a stress of 600 megapascals (MPa) to 1000 MPa; and a hydrogen content of less than 5 atomic percent; and a gate of the GaN FET over the cap layer, wherein the gate is in direct contact with the first surface of the cap layer at a center portion of the gate and partially overlaps the silicon nitride layer at end portions of the gate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A Gallium-Nitride Field Effect Transistor (GaN FET) device, comprising:
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a stack of gallium nitride and aluminum gallium nitride layers as a substrate; a cap layer of gallium nitride on the stack; a silicon nitride layer on a first surface of the cap layer, the silicon nitride layer having the following properties; a silicon;
nitrogen atomic ratio within 2 percent of the ratio 3;
4;a stress of 600 megapascals (MPa) to 1000 MPa; and a hydrogen content of less than 5 atomic percent; a source and a drain, wherein the silicon nitride layer is located between the source and drain; and a gate of the GaN FET over the cap layer between the source and drain, wherein the gate is in direct contact with the first surface of the cap layer at a center portion of the gate and partially overlaps the silicon nitride layer at end portions of the gate. - View Dependent Claims (10, 11, 12)
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13. A Gallium-Nitride Field Effect Transistor (GaN FET) device, comprising:
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a stack of gallium nitride and aluminum gallium nitride layers; a cap layer of gallium nitride on the stack; a silicon nitride layer on the cap layer, the silicon nitride layer having the following properties; a silicon;
nitrogen atomic ratio within 2 percent of the ratio 3;
4;a stress of 600 megapascals (MPa) to 1000 MPa; and a hydrogen content of less than 5 atomic percent; a source and a drain; a gate of the GaN FET over the cap layer between the source and drain, wherein the gate is in direct contact with the cap layer at a center portion of the gate and partially overlaps the silicon nitride layer at end portions of the gate; a source metal in electrical contact with a contact metal of the source, the source metal overlapping the gate; and a dielectric layer between the source metal and the gate, wherein the silicon nitride includes a first portion under the end portions of the gate and a second portion between the gate and the drain spaced from both the drain and the gate.
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Specification